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MRF286S PDF预览

MRF286S

更新时间: 2024-11-24 04:14:39
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管射频
页数 文件大小 规格书
8页 200K
描述
The RF Sub-Micron MOSFET Line RF Power Field Effect Transistors

MRF286S 数据手册

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Order this document  
SEMICONDUCTOR TECHNICAL DATA  
from WISD RF Marketing  
The RF Sub–Micron MOSFET Line  
N–Channel Enhancement–Mode Lateral MOSFETs  
Order sample parts by XRF286,S  
PILOT PRODUCTION PROTOTYPE  
Designed for PCN and PCS base station applications at frequencies from  
1000 to 2400 MHz. Suitable for FM, TDMA, CDMA, and multicarrier amplifier  
applications. To be used in class A and class AB for PCN–PCS/cellular radio  
and WLL applications.  
2000 MHz, 60 W, 26 V  
LATERAL N–CHANNEL  
BROADBAND  
Specified Two–Tone Performance @ 2000 MHz, 26 Volts  
Output Power — 60 Watts (PEP)  
Power Gain — 9.5 dB  
Intermodulation Distortion — –28 dBc  
RF POWER MOSFETs  
Typical Two–Tone Performance at 2000 MHz, 26 Volts  
Output Power — 60 Watts (PEP)  
Power Gain — 10.5 dB  
Efficiency — 32%  
Intermodulation Distortion — –30 dBc  
CASE 465–04, STYLE 1  
(MRF286)  
S–Parameter Characterization at High Bias Levels  
Capable of Handling 10:1 VSWR, @ 26 Vdc,  
2000 MHz, 60 Watts (CW) Output Power  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
CASE 465A–04, STYLE 1  
(MRF286S)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
±20  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
240  
1.37  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.73  
°C/W  
θJC  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
“PILOT PRODUCTION PROTOTYPE (“X” Status)” devices are preproduction products and may not be released or produced in volume.  
“X” status devices are for engineering evaluation and should not be used for production. Specifications are subject to change without notice.  
REV 3  
Motorola, Inc. 2000  

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