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MRF284LR1 PDF预览

MRF284LR1

更新时间: 2024-11-20 20:21:59
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 局域网放大器晶体管
页数 文件大小 规格书
12页 395K
描述
S BAND, Si, N-CHANNEL, RF POWER, MOSFET, NI-360, CASE 360B-05, 2 PIN

MRF284LR1 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, R-CDFM-F2
针数:2Reach Compliance Code:unknown
风险等级:5.12外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:65 V
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:S BAND
JESD-30 代码:R-CDFM-F2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:200 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):87.5 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:AMPLIFIER
晶体管元件材料:SILICONBase Number Matches:1

MRF284LR1 数据手册

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MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF284/D  
The RF Sub-Micron MOSFET Line  
RF Power Field Effect Transistors  
N-Channel Enhancement-Mode Lateral MOSFETs  
MRF284LR1  
MRF284LSR1  
Designed for PCN and PCS base station applications with frequencies from  
1000 to 2600 MHz. Suitable for FM, TDMA, CDMA, and multicarrier amplifier  
applications. To be used in Class A and Class AB for PCN-PCS/cellular radio  
and wireless local loop.  
2000 MHz, 30 W, 26 V  
LATERAL N-CHANNEL  
BROADBAND  
Specified Two-Tone Performance @ 2000 MHz, 26 Volts  
Output Power = 30 Watts PEP  
Power Gain = 9 dB  
RF POWER MOSFETs  
Efficiency = 30%  
Intermodulation Distortion = -29 dBc  
Typical Single-Tone Performance at 2000 MHz, 26 Volts  
Output Power = 30 Watts CW  
Power Gain = 9.5 dB  
Efficiency = 45%  
CASE 360B-05, STYLE 1  
NI-360  
Capable of Handling 10:1 VSWR, @ 26 Vdc, 2000 MHz, 30 Watts CW  
Output Power  
MRF284LR1  
Excellent Thermal Stability  
Characterized with Series Equivalent Large-Signal Impedance Parameters  
In Tape and Reel. R1 Suffix = 500 Units per 32 mm, 13 inch Reel.  
Low Gold Plating Thickness on Leads. L Suffix Indicates 40µ″ Nominal.  
CASE 360C-05, STYLE 1  
NI-360S  
MRF284LSR1  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
Vdc  
Vdc  
DSS  
V
20  
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
87.5  
0.5  
Watts  
W/°C  
C
D
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
- 65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
θ
JC  
2.0  
°C/W  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain-Source Breakdown Voltage  
(V = 0, I = 10 µAdc)  
V
65  
1.0  
10  
Vdc  
µAdc  
µAdc  
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Current  
(V = 20 Vdc, V = 0)  
I
I
DSS  
GSS  
DS  
GS  
Gate-Source Leakage Current  
(V = 20 Vdc, V = 0)  
GS  
DS  
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 14  
Motorola, Inc. 2003  
 

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