Order this document
by MRF284/D
SEMICONDUCTOR TECHNICAL DATA
The RF Sub–Micron MOSFET Line
N–Channel Enhancement–Mode Lateral MOSFETs
Designed for PCN and PCS base station applications at frequencies from
1000 to 2600 MHz. Suitable for FM, TDMA, CDMA, and multicarrier amplifier
applications. To be used in class A and class AB for PCN–PCS/cellular radio
and wireless local loop.
30 W, 2000 MHz, 26 V
LATERAL N–CHANNEL
BROADBAND
•
Specified Two–Tone Performance @ 2000 MHz, 26 Volts
Output Power = 30 Watts (PEP)
Power Gain = 9 dB
RF POWER MOSFETs
Efficiency = 30%
Intermodulation Distortion = –29 dBc
•
Typical Single–Tone Performance at 2000 MHz, 26 Volts
Output Power = 30 Watts (CW)
Power Gain = 9.5 dB
Efficiency = 45%
CASE 360B–01, STYLE 1
(MRF284)
•
•
•
•
Characterized with Series Equivalent Large–Signal Impedance Parameters
S–Parameter Characterization at High Bias Levels
Excellent Thermal Stability
Capable of Handling 10:1 VSWR, @ 26 Vdc, 2000 MHz, 30 Watts (CW)
Output Power
CASE 360C–03, STYLE 1
(MRF284S)
MAXIMUM RATINGS
Rating
Symbol
Value
65
Unit
Vdc
Vdc
Drain–Source Voltage
Gate–Source Voltage
V
DSS
V
GS
±20
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
87.5
0.5
Watts
W/°C
C
Storage Temperature Range
Operating Junction Temperature
T
–65 to +150
200
°C
°C
stg
T
J
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
Max
Unit
R
2.0
°C/W
θJC
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(V = 0, I = 10 µAdc)
V
65
—
—
—
—
—
—
1.0
10
Vdc
µAdc
µAdc
(BR)DSS
GS
Zero Gate Voltage Drain Current
(V = 20 Vdc, V = 0)
D
I
DSS
GSS
DS
Gate–Source Leakage Current
(V = 20 Vdc, V = 0)
GS
I
GS
DS
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 3
MOTOROLA RF DEVICE DATA
Motorola, Inc. 1997
MRF284 MRF284S
1