Document Number: MRF284
Rev. 17, 5/2006
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistors
MRF284LR1
N-Channel Enhancement-Mode Lateral MOSFETs
MRF284LSR1
Designed for PCN and PCS base station applications with frequencies from
1000 to 2600 MHz. Suitable for FM, TDMA, CDMA, and multicarrier amplifier
applications. To be used in Class A and Class AB for PCN-PCS/cellular radio
and wireless local loop.
2000 MHz, 30 W, 26 V
LATERAL N-CHANNEL
BROADBAND
• Specified Two-Tone Performance @ 2000 MHz, 26 Volts
Output Power = 30 Watts PEP
Power Gain = 9 dB
RF POWER MOSFETs
Efficiency = 30%
Intermodulation Distortion = -29 dBc
• Typical Single-Tone Performance at 2000 MHz, 26 Volts
Output Power = 30 Watts CW
Power Gain = 9.5 dB
Efficiency = 45%
CASE 360B-05, STYLE 1
NI-360
• Capable of Handling 10:1 VSWR, @ 26 Vdc, 2000 MHz, 30 Watts CW
Output Power
MRF284LR1
Features
• Excellent Thermal Stability
• Characterized with Series Equivalent Large-Signal Impedance Parameters
• Low Gold Plating Thickness on Leads. L Suffix Indicates 40μ″ Nominal.
• RoHS Compliant
CASE 360C-05, STYLE 1
NI-360S
• In Tape and Reel. R1 Suffix = 500 Units per 32 mm, 13 inch Reel.
MRF284LSR1
Table 1. Maximum Ratings
Rating
Symbol
Value
-0.5, +65
20
Unit
Vdc
Vdc
Drain-Source Voltage
Gate-Source Voltage
V
DSS
V
GS
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
87.5
0.5
W
W/°C
C
D
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
T
- 65 to +150
150
°C
°C
°C
stg
T
C
T
200
J
Table 2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
θ
JC
2.0
°C/W
Table 3. Electrical Characteristics (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
(V = 0, I = 10 μAdc)
V
65
—
—
—
—
—
—
1.0
10
Vdc
(BR)DSS
GS
D
Zero Gate Voltage Drain Current
(V = 20 Vdc, V = 0)
I
μAdc
DSS
DS
GS
Gate-Source Leakage Current
(V = 20 Vdc, V = 0)
I
μAdc
GSS
GS
DS
(continued)
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MRF284LR1 MRF284LSR1
RF Device Data
Freescale Semiconductor
1