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MRF175GU1111 PDF预览

MRF175GU1111

更新时间: 2024-11-17 22:32:55
品牌 Logo 应用领域
泰科 - TE 射频
页数 文件大小 规格书
10页 209K
描述
N-CHANNEL MOS BROADBAND RF POWER FETs

MRF175GU1111 数据手册

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Order this document  
SEMICONDUCTOR TECHNICAL DATA  
by MRF176GU/D  
The RF MOSFET Line  
R
F
P
o
w
e
r
M
R
F
1
7
6
G
U
F
i
e
l
d
-
E
f
f
e
c
t
T
r
a
n
s
i
s
t
o
r
s
M
R
F
1
7
6
G
V
N–Channel Enhancement–Mode  
Designed for broadband commercial and military applications using push pull  
circuits at frequencies to 500 MHz. The high power, high gain and broadband  
performance of these devices makes possible solid state transmitters for FM  
broadcast or TV channel frequency bands.  
200/150 W, 50 V, 500 MHz  
N–CHANNEL MOS  
BROADBAND  
Electrical Performance  
RF POWER FETs  
MRF176GU @ 50 V, 400 MHz (“U” Suffix)  
Output Power — 150 Watts  
Power Gain — 14 dB Typ  
D
Efficiency — 50% Typ  
MRF176GV @ 50 V, 225 MHz (“V” Suffix)  
Output Power — 200 Watts  
Power Gain — 17 dB Typ  
G
G
S
Efficiency — 55% Typ  
(
F
L
A
N
G
E
)
100% Ruggedness Tested At Rated Output Power  
Low Thermal Resistance  
D
Low Crss — 7.0 pF Typ @ VDS = 50 V  
CASE 375–04, STYLE 2  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
125  
±40  
16  
Unit  
Vdc  
Vdc  
Adc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
Drain Current — Continuous  
I
D
Total Device Dissipation @ T = 25°C  
P
D
400  
Watts  
C
Derate above 25°C  
2.27  
W/°C  
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.44  
°C/W  
θ
JC  
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS (1)  
Drain–Source Breakdown Voltage  
(V = 0, I = 100 mA)  
V
125  
Vdc  
mAdc  
µAdc  
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Current  
(V = 50 V, V = 0)  
I
2.5  
1.0  
DSS  
DS  
GS  
Gate–Body Leakage Current  
(V = 20 V, V = 0)  
I
GSS  
GS  
DS  
NOTE:  
1. Each side of device measured separately.  
REV 9  
1

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