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SEMICONDUCTOR TECHNICAL DATA
by MRF176GU/D
The RF MOSFET Line
R
F
P
o
w
e
r
M
R
F
1
7
6
G
U
F
i
e
l
d
-
E
f
f
e
c
t
T
r
a
n
s
i
s
t
o
r
s
M
R
F
1
7
6
G
V
N–Channel Enhancement–Mode
Designed for broadband commercial and military applications using push pull
circuits at frequencies to 500 MHz. The high power, high gain and broadband
performance of these devices makes possible solid state transmitters for FM
broadcast or TV channel frequency bands.
200/150 W, 50 V, 500 MHz
N–CHANNEL MOS
BROADBAND
•
Electrical Performance
RF POWER FETs
MRF176GU @ 50 V, 400 MHz (“U” Suffix)
Output Power — 150 Watts
Power Gain — 14 dB Typ
D
Efficiency — 50% Typ
MRF176GV @ 50 V, 225 MHz (“V” Suffix)
Output Power — 200 Watts
Power Gain — 17 dB Typ
G
G
S
Efficiency — 55% Typ
(
F
L
A
N
G
E
)
•
•
•
100% Ruggedness Tested At Rated Output Power
Low Thermal Resistance
D
Low Crss — 7.0 pF Typ @ VDS = 50 V
CASE 375–04, STYLE 2
MAXIMUM RATINGS
Rating
Symbol
Value
125
±40
16
Unit
Vdc
Vdc
Adc
Drain–Source Voltage
Gate–Source Voltage
V
DSS
V
GS
Drain Current — Continuous
I
D
Total Device Dissipation @ T = 25°C
P
D
400
Watts
C
Derate above 25°C
2.27
W/°C
Storage Temperature Range
Operating Junction Temperature
THERMAL CHARACTERISTICS
T
–65 to +150
200
°C
°C
stg
T
J
Characteristic
Thermal Resistance, Junction to Case
Symbol
Max
Unit
R
0.44
°C/W
θ
JC
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS (1)
Drain–Source Breakdown Voltage
(V = 0, I = 100 mA)
V
125
—
—
—
—
—
Vdc
mAdc
µAdc
(BR)DSS
GS
D
Zero Gate Voltage Drain Current
(V = 50 V, V = 0)
I
2.5
1.0
DSS
DS
GS
Gate–Body Leakage Current
(V = 20 V, V = 0)
I
—
GSS
GS
DS
NOTE:
1. Each side of device measured separately.
REV 9
1