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MRF175LU PDF预览

MRF175LU

更新时间: 2024-11-20 22:40:51
品牌 Logo 应用领域
泰科 - TE 晶体晶体管射频放大器局域网
页数 文件大小 规格书
8页 148K
描述
N-CHANNEL BROADBAND RF POWER FETs

MRF175LU 技术参数

是否Rohs认证: 符合生命周期:Transferred
针数:6Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.3
Is Samacsys:N配置:SINGLE
最小漏源击穿电压:65 V最大漏极电流 (ID):13 A
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:ULTRA HIGH FREQUENCY BAND
JESD-30 代码:R-CDFM-F6元件数量:1
端子数量:6工作模式:ENHANCEMENT MODE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF175LU 数据手册

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M O T OR OLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF175LU/D  
The RF MOSFET Line  
R
F
P
o
w
e
r
M
R
F
1
7
5
L
U
F
i
e
l
d
-
E
f
f
e
c
t
Tr ans i st or s  
M
R
F
1
7
5
L
V
N–Channel Enhancement–Mode  
Designed for broadband commercial and military applications using single  
ended circuits at frequencies to 400 MHz. The high power, high gain and  
broadband performance of each device makes possible solid state transmitters  
for FM broadcast or TV channel frequency bands.  
100 W, 28 V, 400 MHz  
N–CHANNEL  
Guaranteed Performance  
BROADBAND  
RF POWER FETs  
MRF175LU @ 28 V, 400 MHz (“U” Suffix)  
Output Power — 100 Watts  
Power Gain — 10 dB Typ  
Efficiency — 55% Typ  
MRF175LV @ 28 V, 225 MHz (“V” Suffix)  
Output Power — 100 Watts  
Power Gain — 14 dB Typ  
Efficiency — 65% Typ  
D
100% Ruggedness Tested At Rated Output Power  
Low Thermal Resistance  
Low Crss — 20 pF Typ @ VDS = 28 V  
G
CASE 333–04, STYLE 2  
S
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Adc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
±40  
13  
Drain Current — Continuous  
I
D
Total Device Dissipation @ T = 25°C  
P
D
270  
Watts  
C
Derate above 25°C  
1.54  
W/°C  
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.65  
°C/W  
θ
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage  
(V = 0, I = 50 mA)  
V
65  
Vdc  
mAdc  
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Current  
(V = 28 V, V = 0)  
I
2.5  
1.0  
DSS  
DS  
GS  
Gate–Body Leakage Current  
(V = 20 V, V = 0)  
I
µAdc  
GSS  
GS  
DS  
(continued)  
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 8  
Motorola, Inc. 1997  

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