Datasheet > MJD47_11

MJD47_11

更新时间： 2024-11-06 10:55:51

品牌	Logo	应用领域
安森美 - ONSEMI		晶体晶体管
页数	文件大小	规格书
5页	110K
描述
High Voltage Power Transistors

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数据手册

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MJD47_11 数据手册

MJD47, MJD50

High Voltage Power

Transistors

DPAK For Surface Mount Applications

Designed for line operated audio output amplifier,

SWITCHMODEt power supply drivers and other switching

applications.

http://onsemi.com

Features

NPN SILICON POWER

TRANSISTORS

1 AMPERE

250, 400 VOLTS, 15 WATTS

• Lead Formed for Surface Mount Applications in Plastic Sleeves

(No Suffix)

• Electrically Similar to Popular TIP47, and TIP50

• 250 and 400 V (Min) − V

CEO(sus)

• 1 A Rated Collector Current

• Epoxy Meets UL 94 V−0 @ 0.125 in

• ESD Ratings: Human Body Model, 3B u 8000 V

Machine Model, C u 400 V

• These are Pb−Free Packages

DPAK

CASE 369C

STYLE 1

MAXIMUM RATINGS

Rating

Symbol

Max

Unit

Collector−Emitter Voltage

CEO

Vdc

MJD47

MJD50

250

400

MARKING DIAGRAM

Collector−Base Voltage

Emitter−Base Voltage

Vdc

AYWW

JxxG

MJD47

MJD50

350

500

Vdc

Adc

Collector Current − Continuous

− Peak

= Assembly Location

= Year

WW = Work Week

Jxx = Device Code

xx = 47 or 50

Base Current

0.6

mAdc

Total Power Dissipation

0.12

@ T = 25°C

= Pb−Free Package

W/°C

Derate above 25°C

Total Power Dissipation (Note 1)

1.56

@ T = 25°C

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

0.0125

Derate above 25°C

W/°C

°C

Operating and Storage Junction

Temperature Range

T , T

−65 to +150

stg

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

8.33

Unit

°C/W

Thermal Resistance Junction−to−Case

Thermal Resistance Junction−to−Ambient

(Note 1)

Lead Temperature for Soldering Purpose

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. These ratings are applicable when surface mounted on the minimum pad

sizes recommended.

Publication Order Number:

January, 2011 − Rev. 10

MJD47/D

12 3 4 5

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