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MJD44H11T4G PDF预览

MJD44H11T4G

更新时间: 2024-10-31 22:46:15
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
8页 92K
描述
SILICON POWER TRANSISTORS

MJD44H11T4G 数据手册

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MJD44H11 (NPN)  
MJD45H11 (PNP)  
Preferred Device  
Complementary Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for general purpose power and switching such as output or  
driver stages in applications such as switching regulators, converters,  
and power amplifiers.  
SILICON  
POWER TRANSISTORS  
8 AMPERES  
Features  
Pb−Free Packages are Available  
Lead Formed for Surface Mount Application in Plastic Sleeves  
(No Suffix)  
80 VOLTS  
20 WATTS  
Straight Lead Version in Plastic Sleeves (“−1” Suffix)  
Lead Formed Version in 16 mm Tape and Reel for Surface Mount  
(“T4” Suffix)  
MARKING  
DIAGRAMS  
Electrically Similar to Popular D44H/D45H Series  
Low Collector Emitter Saturation Voltage −  
4
YWW  
J4  
xH11  
DPAK  
CASE 369C  
STYLE 1  
V
CE(sat)  
= 1.0 Volt Max @ 8.0 Amperes  
Fast Switching Speeds  
Complementary Pairs Simplifies Designs  
2
1
3
Epoxy Meets UL 94, V−0 @ 0.125 in  
ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
4
YWW  
J4  
xH11  
DPAK−3  
CASE 369D  
STYLE 1  
MAXIMUM RATINGS  
1
Rating  
Collector−Emitter Voltage  
Emitter−Base Voltage  
Symbol  
Max  
80  
5
Unit  
Vdc  
Vdc  
Adc  
2
3
V
CEO  
V
EB  
Y
= Year  
WW  
x
= Work Week  
= 4 or 5  
I
C
8
16  
Collector Current − Continuous  
Peak  
P
20  
0.16  
W
W/°C  
Total Power Dissipation @ T = 25°C  
D
D
C
Derate above 25°C  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
P
1.75  
0.014  
Total Power Dissipation* @ T = 25°C  
W
W/°C  
A
Derate above 25°C  
dimensions section on page 3 of this data sheet.  
Operating and Storage Junction Temperature  
Range  
T , T  
55 to  
+150  
°C  
J
stg  
Preferred devices are recommended choices for future use  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
and best overall value.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Case  
Thermal Resistance, Junction−to−Ambient*  
Lead Temperature for Soldering  
R
6.25  
71.4  
260  
°C/W  
°C/W  
°C  
q
q
JC  
JA  
L
R
T
*These ratings are applicable when surface mounted on the minimum pad sizes  
recommended.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 6  
MJD44H11/D  

MJD44H11T4G 替代型号

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MJD44H11T5 ONSEMI

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