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IXTA1N100P PDF预览

IXTA1N100P

更新时间: 2024-11-21 13:00:43
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
2页 49K
描述
Power Field-Effect Transistor, 1A I(D), 1000V, 15ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, TO-263, 3 PIN

IXTA1N100P 技术参数

是否无铅:不含铅生命周期:Transferred
零件包装代码:D2PAK包装说明:SMALL OUTLINE, R-PSSO-G2
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.66
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):100 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:1000 V
最大漏极电流 (Abs) (ID):1 A最大漏极电流 (ID):1 A
最大漏源导通电阻:15 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):50 W
最大脉冲漏极电流 (IDM):1.8 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXTA1N100P 数据手册

 浏览型号IXTA1N100P的Datasheet PDF文件第2页 
Advanced Technical Information  
High Voltage  
MOSFET  
IXTA 1N100  
IXTP 1N100  
VDSS = 1000 V  
ID25 = 1.5 A  
RDS(on) = 11 Ω  
N-Channel Enhancement Mode  
Avalanche Energy Rated  
Symbol  
TestConditions  
MaximumRatings  
TO-220AB (IXTP)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
1000  
1000  
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
AB)  
G
VGSM  
D
S
ID25  
IDM  
TC = 25°C  
1.5  
6
A
A
TC = 25°C, pulse width limited by TJM  
TO-263 AA (IXTA)  
IAR  
1.5  
A
EAR  
EAS  
TC = 25°C  
TC = 25°C  
6
mJ  
mJ  
200  
G
S
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 18 Ω  
,
3
V/ns  
D (TAB)  
PD  
TC = 25°C  
54  
W
G = Gate,  
S = Source,  
D = Drain,  
TAB = Drain  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
-55 ... +150  
Md  
Mountingtorque  
1.13/10 Nm/lb.in.  
Features  
Weight  
4
g
Ÿ Internationalstandardpackages  
Ÿ High voltage, Low RDS (on) HDMOSTM  
process  
Maximumleadtemperatureforsoldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Ÿ Rugged polysilicon gate cell structure  
Ÿ Fast switching times  
Applications  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Ÿ Switch-modeandresonant-mode  
powersupplies  
Ÿ Flyback inverters  
VDSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 25 µA  
1000  
2.5  
V
V
VGS(th)  
4.5  
Ÿ DC choppers  
Ÿ Highfrequencymatching  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100 nA  
Advantages  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
25 µA  
500 µA  
Ÿ Space savings  
Ÿ High power density  
RDS(on)  
VGS = 10 V, ID = 1.0A  
Pulse test, t 300 µs, duty cycle d 2 %  
11  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98545A(11/99)  
1 - 2  

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