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IXFR12N100Q PDF预览

IXFR12N100Q

更新时间: 2024-11-17 21:55:19
品牌 Logo 应用领域
IXYS 栅极
页数 文件大小 规格书
2页 36K
描述
N-Channel Enhancement Mode Avalanche Rated, High dV/dt Low Gate Charge and Capacitances

IXFR12N100Q 技术参数

是否无铅: 不含铅生命周期:Transferred
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknown风险等级:5.71
其他特性:AVALANCHE RATED外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:1000 V
最大漏极电流 (Abs) (ID):10 A最大漏极电流 (ID):10 A
最大漏源导通电阻:1.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):250 W
最大脉冲漏极电流 (IDM):48 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFR12N100Q 数据手册

 浏览型号IXFR12N100Q的Datasheet PDF文件第2页 
Advanced Technical Information  
HiPerFETTM Power MOSFETs  
VDSS  
ID25  
RDS(on)  
ISOPLUS247TM Q CLASS  
IXFR 12N100Q 1000V 10 A  
IXFR 10N100Q 1000V 9 A  
1.05 W  
1.20 W  
(Electrically Isolated Back Surface)  
trr £ 200 ns  
N-Channel Enhancement Mode  
Avalanche Rated, High dV/dt  
Low Gate Charge and Capacitances  
Symbol  
TestConditions  
MaximumRatings  
ISOPLUS 247TM  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MW  
1000  
1000  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
G
D
Isolated back surface*  
D = Drain  
ID25  
IDM  
IAR  
TC = 25°C  
12N100  
10N100  
12N100  
10N100  
12N100  
10N100  
10  
9
48  
40  
12  
10  
A
A
A
A
A
A
TC = 25°C, Pulse width limited by TJM  
TC = 25°C  
G = Gate  
S = Source  
*Patentpending  
EAR  
TC = 25°C  
30  
5
mJ  
Features  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
V/ns  
• SiliconchiponDirect-Copper-Bond  
substrate  
PD  
TC = 25°C  
250  
W
- High power dissipation  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
- Isolated mounting surface  
- 2500V electricalisolation  
• Low drain to tab capacitance(<50pF)  
• Low RDS (on) HDMOSTM process  
• Rugged polysilicon gate cell structure  
• Unclamped Inductive Switching (UIS)  
rated  
TL  
1.6 mm (0.063 in.) from case for 10 s  
300  
2500  
5
°C  
V~  
g
VISOL  
Weight  
50/60 Hz, RMS  
t = 1 min  
• Fast intrinsic Rectifier  
Applications  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
• DC-DC converters  
• Battery chargers  
• Switched-modeandresonant-mode  
powersupplies  
• DC choppers  
• AC motor control  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 3mA  
VDS = VGS, ID = 4mA  
VGS = ±20 VDC, VDS = 0  
1000  
2.5  
V
V
5.5  
±100  
nA  
Advantages  
IDSS  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
50  
1
mA  
mA  
• Easy assembly  
• Space savings  
• High power density  
RDS(on)  
VGS = 10 V, ID = IT  
Notes 1 & 2  
12N100  
10N100  
1.05  
1.2  
W
W
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98589(1/99)  
1 - 2  

IXFR12N100Q 替代型号

型号 品牌 替代类型 描述 数据表
IXFR10N100Q IXYS

完全替代

N-Channel Enhancement Mode Avalanche Rated, High dV/dt Low Gate Charge and Capacitances
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