PolarTM Power MOSFET
HiPerFETTM
VDSS = 1200V
ID25 = 9A
RDS(on) ≤ 1.04Ω
≤ 300ns
IXFR16N120P
N-Channel Enhancement Mode
AvalancheRated
Fast Intrinsic Diode
trr
ISOPLUS247(IXFR)
E153432
Symbol
VDSS
TestConditions
MaximumRatings
TJ = 25°C to 150°C
1200
1200
V
V
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
VGSS
VGSM
Continuous
Transient
± 30
± 40
V
V
ID25
IDM
TC =25°C
9
A
A
IsolatedTab
TC = 25°C, pulse width limited by TJM
35
IA
TC =25°C
TC =25°C
8
A
G = Gate
S = Source
D
= Drain
EAS
800
mJ
dV/dt
PD
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC =25°C
15
V/ns
W
Features
230
• Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
TJ
-55 ... +150
150
°C
°C
°C
TJM
Tstg
-55 ... +150
• Low drain to tab capacitance(<30pF)
TL
Maximum lead temperature for soldering
Plastic body for 10s
300
260
°C
°C
V~
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS)
TSOLD
VISOL
FC
50/60 Hz, RMS, 1 minute
Mountingforce
2500
• Fraatesdt intrinsic Rectifier
20..120/4.5..27
5
N/lb.
Advantages
Weight
g
• Easyassembly
• Spacesavings
• High power density
Applications:
Symbol
TestConditions
Characteristic Values
Min. Typ. Max.
(TJ = 25°C, unless otherwise specified)
ꢀHigh Voltage Switched-mode and
resonant-mode powersupplies
ꢀHigh Voltage Pulse Power Applications
ꢀHigh Voltage Discharge circuits in
Lasers Pulsers, Spark Igniters, RF
Generators
BVDSS
VGS(th)
IGSS
VGS = 0V, ID = 1mA
VDS = VGS, ID = 1mA
VGS = ± 30V, VDS = 0V
1200
3.5
V
V
6.5
± 200 nA
ꢀHigh Voltage DC-DC converters
ꢀHigh Voltage DC-AC inverters
IDSS
VDS = VDSS
VGS = 0V
25 μA
2.5 mA
TJ = 125°C
RDS(on)
VGS = 10V, ID = 8A, Note 1
1.04
Ω
DS99897A(04/08)
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