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IXFJ13N50 PDF预览

IXFJ13N50

更新时间: 2024-11-17 23:13:35
品牌 Logo 应用领域
IXYS 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
4页 71K
描述
HiPerFET Power MOSFETs

IXFJ13N50 技术参数

是否无铅: 不含铅生命周期:Transferred
零件包装代码:TO-268AA包装说明:IN-LINE, R-PSIP-T3
针数:4Reach Compliance Code:unknown
风险等级:5.76其他特性:AVALANCHE RATED
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):13 A
最大漏极电流 (ID):13 A最大漏源导通电阻:0.4 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-268AA
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):180 W
最大脉冲漏极电流 (IDM):52 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFJ13N50 数据手册

 浏览型号IXFJ13N50的Datasheet PDF文件第2页浏览型号IXFJ13N50的Datasheet PDF文件第3页浏览型号IXFJ13N50的Datasheet PDF文件第4页 
HiPerFETTM  
IXFJ 13N50 VDSS  
= 500 V  
Power MOSFETs  
ID (cont) = 13 A  
RDS(on) = 0.4 W  
N-Channel Enhancement Mode  
High dv/dt, Low trr, HDMOSTM Family  
trr  
£ 250 ns  
Symbol  
TestConditions  
MaximumRatings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
500  
500  
V
V
G
TJ = 25°C to 150°C; RGS = 1 MW  
D
é
(TAB)  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
S
VGSM  
ID25  
IDM  
IAR  
TC = 25°C  
13  
52  
13  
A
A
A
G = Gate,  
S = Source,  
D = Drain,  
TAB = Drain  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
EAR  
TC = 25°C  
18  
5
mJ  
Features  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
,
V/ns  
• Low profile, high power package  
• Long creep and strike distances  
• Easy up-grade path for TO-220  
designs  
PD  
TC = 25°C  
180  
W
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
• Low RDS (on) HDMOSTM process  
• Rugged polysilicon gate cell structure  
• Unclamped Inductive Switching (UIS)  
rated  
TJM  
Tstg  
-55 ... +150  
TL  
1.6 mm (0.062 in.) from case for 10 s  
300  
5
°C  
• Low package inductance  
- easy to drive and to protect  
• Fast intrinsic Rectifier  
Weight  
g
Applications  
• DC-DC converters  
• Synchronousrectification  
• Battery chargers  
• Switched-modeandresonant-mode  
powersupplies  
• DC choppers  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
VDSS  
VGS = 0 V, ID = 250 mA  
500  
2
V
V
VGS(th)  
VDS = VGS, ID = 2.5 mA  
4
• AC motor control  
• Temperatureandlightingcontrols  
• Low voltage relays  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100  
nA  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
200 mA  
1
Advantages  
mA  
• High power, low profile package  
• Space savings  
• High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t £ 300 ms, duty cycle d £ 2 %  
0.4  
W
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98578(2/99)  
1 - 4  

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