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IRLMS1503_05 PDF预览

IRLMS1503_05

更新时间: 2024-10-30 04:23:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 151K
描述
HEXFET㈢ Power MOSFET

IRLMS1503_05 数据手册

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PD - 95762  
IRLMS1503PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Micro6 Package Style  
l Ultra Low RDS(on)  
l N-Channel MOSFET  
l Lead-Free  
A
1
2
6
D
D
D
VDSS = 30V  
5
D
3
4
G
S
R
DS(on) = 0.10Ω  
Description  
Top View  
Fifth Generation HEXFET® power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance  
per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that  
HEXFET® power MOSFETs are well known for,  
provides the designer with an extremely efficient and  
reliable device for use in a wide variety of applications.  
The Micro6package with its customized leadframe  
produces a HEXFET® power MOSFET with RDS(on)  
60% less than a similar size SOT-23. This package is  
idealforapplicationswhereprintedcircuitboardspace  
isatapremium. It'suniquethermaldesignandRDS(on)  
reduction enables a current-handling increase of  
nearly 300% compared to the SOT-23.  
Micro6™  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
3.2  
2.6  
A
18  
PD @TA = 25°C  
Power Dissipation  
1.7  
13  
W
mW/°C  
V
Linear Derating Factor  
VGS  
Gate-to-Source Voltage  
± 20  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
5.0  
V/ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Min.  
Typ.  
Max  
Units  
RθJA  
Maximum Junction-to-Ambient „  
–––  
–––  
75  
°C/W  
www.irf.com  
1
1/14/05  

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