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IRLMS4502 PDF预览

IRLMS4502

更新时间: 2024-11-17 22:23:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
7页 96K
描述
HEXFET Power MOSFET

IRLMS4502 数据手册

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PD- 93759B  
IRLMS4502  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Surface Mount  
A
1
2
6
D
D
D
VDSS = -12V  
5
D
l Available in Tape & Reel  
3
4
G
S
RDS(on) = 0.042Ω  
Top View  
Description  
These P-Channel MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve the  
extremely low on-resistance per silicon area. This benefit  
provides the designer with an extremely efficient device for  
use in battery and load management applications..  
The Micro6 package with its customized leadframe  
produces a HEXFET power MOSFET with Rds(on) 60%  
less than a similar size SOT-23. This package is ideal for  
applications where printed circuit board space is at a  
premium. It'suniquethermaldesignandRDS(on) reduction  
enables a current-handling increase of nearly 300%  
compared to the SOT-23.  
Micro6ä  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-12  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-5.5  
-4.4  
A
-44  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.7  
W
Power Dissipation  
1.1  
Linear Derating Factor  
0.013  
28  
W/°C  
mJ  
V
EAS  
Single Pulse Avalanche Energy„  
Gate-to-Source Voltage  
VGS  
± 12  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
75  
Units  
°C/W  
RθJA  
www.irf.com  
1
01/13/03  

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