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IRLMS6702 PDF预览

IRLMS6702

更新时间: 2024-11-20 22:23:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 202K
描述
HEXFET Power MOSFET

IRLMS6702 数据手册

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PD - 91414C  
IRLMS6702  
HEXFET® Power MOSFET  
l Generation V Technology  
l Micro6 Package Style  
l Ultra Low RDS(on)  
A
1
2
6
D
D
D
VDSS = -20V  
5
D
l P-Channel MOSFET  
3
4
G
S
RDS(on) = 0.20Ω  
Description  
Fifth Generation HEXFET® power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance  
per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that  
HEXFET® power MOSFETs are well known for,  
provides the designer with an extremely efficient and  
reliable device for use in a wide variety of applications.  
Top View  
The Micro6package with its customized leadframe  
produces a HEXFET® power MOSFET with RDS(on)  
60% less than a similar size SOT-23. This package is  
idealforapplicationswhereprintedcircuitboardspace  
isatapremium. It'suniquethermaldesignandRDS(on)  
reduction enables a current-handling increase of  
nearly 300% compared to the SOT-23.  
Micro6  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-2.4  
-1.9  
A
-13  
PD @TA = 25°C  
Power Dissipation  
1.7  
W
mW/°C  
V
Linear Derating Factor  
13  
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
5.0  
V/ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Min.  
Typ.  
Max  
Units  
RθJA  
Maximum Junction-to-Ambient „  
–––  
–––  
75  
°C/W  
www.irf.com  
1
3/18/04  

IRLMS6702 替代型号

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