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IRLML9303PBF_15 PDF预览

IRLML9303PBF_15

更新时间: 2024-11-19 01:20:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 206K
描述
Compatible with existing Surface Mount Techniques

IRLML9303PBF_15 数据手册

 浏览型号IRLML9303PBF_15的Datasheet PDF文件第2页浏览型号IRLML9303PBF_15的Datasheet PDF文件第3页浏览型号IRLML9303PBF_15的Datasheet PDF文件第4页浏览型号IRLML9303PBF_15的Datasheet PDF文件第5页浏览型号IRLML9303PBF_15的Datasheet PDF文件第6页浏览型号IRLML9303PBF_15的Datasheet PDF文件第7页 
PD - 97519B  
IRLML9303TRPbF  
HEXFET® Power MOSFET  
VDS  
-30  
V
V
VGS Max  
± 20  
RDS(on) max  
(@VGS = -10V)  
165  
270  
m
RDS(on) max  
(@VGS = -4.5V)  
TM  
m
Micro3 (SOT-23)  
IRLML9303TRPbF  
Application(s)  
System/Load Switch  
Features and Benefits  
Features  
Benefits  
Industry-standard pinout  
Multi-vendor compatibility  
Compatible with existing Surface Mount Techniques  
RoHS compliant containing no lead, no bromide and no halogen  
MSL1, Consumer qualification  
results in Easier manufacturing  
Environmentally friendly  
Increased reliability  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
V
VDS  
-30  
-2.3  
-1.8  
-12  
Drain-Source Voltage  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
A
Pulsed Drain Current  
PD @TA = 25°C  
PD @TA = 70°C  
1.25  
0.80  
0.01  
± 20  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
VGS  
Gate-to-Source Voltage  
TJ, TSTG  
-55 to + 150  
Junction and Storage Temperature Range  
°C  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
100  
Units  
RJA  
Junction-to-Ambient  
Junction-to-Ambient (t<10s)  
ORDERING INFORMATION:  
°C/W  
RJA  
–––  
99  
See detailed ordering and shipping information on the last page of this data sheet.  
Notes  through „ are on page 10  
www.irf.com  
1
03/09/12  

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