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IRLML6402TR PDF预览

IRLML6402TR

更新时间: 2024-10-29 22:23:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 133K
描述
HEXFET Power MOSFET

IRLML6402TR 数据手册

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PD - 93755B  
IRLML6402  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l SOT-23 Footprint  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
D
VDSS = -20V  
G
RDS(on) = 0.065  
S
Description  
These P-Channel MOSFETs from International Rectifier utilize  
advanced processing techniques to achieve extremely low on-  
resistance per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that HEXFET  
power MOSFETs are well known for, provides the designer with  
an extremely efficient and reliable device for use in battery and  
load management.  
Athermallyenhancedlargepadleadframehasbeenincorporated  
into the standard SOT-23 package to produce a HEXFET Power  
MOSFET with the industry's smallest footprint. This package,  
dubbed the Micro3, is ideal for applications where printed  
circuit board space is at a premium. The low profile (<1.1mm)  
of the Micro3 allows it to fit easily into extremely thin application  
environments such as portable electronics and PCMCIA cards.  
The thermal resistance and power dissipation are the best  
available.  
Micro3  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-20  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-3.7  
-2.2  
A
-22  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.3  
W
Power Dissipation  
0.8  
Linear Derating Factor  
0.01  
W/°C  
mJ  
V
EAS  
Single Pulse Avalanche Energy„  
Gate-to-Source Voltage  
11  
VGS  
± 12  
-55 to + 150  
TJ, TSTG  
Junction and Storage Temperature Range  
°C  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambientƒ  
75  
100  
°C/W  
www.irf.com  
1
04/29/03  

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