IRFR024, IRFU024, SiHFR024, SiHFU024
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
60
Available
• Surface Mount (IRFR024/SiHFR024)
0.10
RDS(on) (Ω)
VGS = 10 V
RoHS*
• Straight Lead (IRFU024/SiHFU024)
COMPLIANT
Qg (Max.) (nC)
25
5.8
• Available in Tape and Reel
• Fast Switching
Q
gs (nC)
Qgd (nC)
11
Configuration
Single
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
D
DPAK
IPAK
(TO-252)
(TO-251)
DESCRIPTION
G
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
IRFU024PbF
SiHFU024-E3
IRFU024
IRFR024PbF
SiHFR024-E3
IRFR024
IRFR024TRPbFa
SiHFR024T-E3a
IRFR024TRa
-
Lead (Pb)-free
-
IRFR024TRLa
SiHFR024TLa
SnPb
SiHFR024
SiHFR024Ta
SiHFU024
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
60
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
TC = 25 °C
TC =100°C
14
9.0
Continuous Drain Current
VGS at 10 V
ID
A
Pulsed Drain Currenta
IDM
56
Linear Derating Factor
0.33
0.020
91
W/°C
mJ
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
EAS
PD
TC = 25 °C
TA = 25 °C
42
W
2.5
dV/dt
5.5
V/ns
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