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IRFR024TRA PDF预览

IRFR024TRA

更新时间: 2024-09-29 06:45:39
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威世 - VISHAY /
页数 文件大小 规格书
10页 1159K
描述
Transistor

IRFR024TRA 数据手册

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IRFR024, IRFU024, SiHFR024, SiHFU024  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
60  
Definition  
• Dynamic dV/dt Rating  
RDS(on) (Ω)  
VGS = 10 V  
0.10  
• Surface Mount (IRFR024, SiHFR024)  
• Straight Lead (IRFU024, SiHFU024)  
• Available in Tape and Reel  
• Fast Switching  
Qg (Max.) (nC)  
25  
5.8  
Q
Q
gs (nC)  
gd (nC)  
11  
• Ease of Paralleling  
• Simple Drive Requirements  
• Compliant to RoHS Directive 2002/95/EC  
Configuration  
Single  
D
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
D
D
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU, SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
S
G
S
D
G
S
N-Channel MOSFET  
are possible in typical surface mount applications.  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
SiHFR024-GE3  
IRFR024PbF  
SiHFR024-E3  
IRFR024  
DPAK (TO-252)  
SiHFR024TR-GE3  
IRFR024TRPbFa  
SiHFR024T-E3a  
IRFR024TRa  
DPAK (TO-252)  
IPAK (TO-251)  
SiHFU024-GE3  
IRFU024PbF  
SiHFU024-E3  
IRFU024  
Lead (Pb)-free and Halogen-free  
SiHFR024TRL-GE3  
-
Lead (Pb)-free  
SnPb  
-
IRFR024TRLa  
SiHFR024TLa  
SiHFR024  
SiHFR024Ta  
SiHFU024  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
60  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
T
C = 25 °C  
14  
9.0  
Continuous Drain Current  
VGS at 10 V  
ID  
T
C = 100 °C  
A
Pulsed Drain Currenta  
IDM  
56  
Linear Derating Factor  
0.33  
0.020  
91  
W/°C  
mJ  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
EAS  
PD  
TC = 25 °C  
TA = 25 °C  
42  
W
2.5  
dV/dt  
5.5  
V/ns  
°C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 541 μH, Rg = 25 Ω, IAS = 14 A (see fig. 12).  
c. ISD 17 A, dI/dt 110 A/μs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91264  
S10-1122-Rev. C, 10-May-10  
www.vishay.com  
1

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