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IRFPS3810PBF PDF预览

IRFPS3810PBF

更新时间: 2024-11-28 04:23:23
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 173K
描述
HEXFET㈢ Power MOSFET

IRFPS3810PBF 数据手册

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PD - 95703  
IRFPS3810PbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
D
VDSS = 100V  
l 175°C Operating Temperature  
l Fast Switching  
RDS(on) = 0.009Ω  
G
l Fully Avalanche Rated  
ID = 170A†  
l Lead-Free  
S
Description  
The HEXFET® Power MOSFETs from International  
Rectifier utilize advanced processing techniques to  
achieve extremely low on-resistance per silicon area.  
This benefit, combined with the fast switching speed  
and ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in  
a wide variety of applications.  
Super-247™  
Absolute Maximum Ratings  
Parameter  
Max.  
170†  
120†  
670  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
PD @TC = 25°C  
Power Dissipation  
580  
W
W/°C  
V
Linear Derating Factor  
3.8  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 30  
1350  
100  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
58  
mJ  
V/ns  
2.3  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
0.26  
–––  
40  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.24  
–––  
°C/W  
www.irf.com  
1
9/10/04  

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