PD - 94630
SMPS MOSFET
IRFPS38N60L
HEXFET® Power MOSFET
Applications
• Zero Voltage Switching SMPS
Trr typ.
VDSS RDS(on) typ.
120m
ID
• Telecom and Server Power Supplies
• Uninterruptible Power Supplies
• Motor Control applications
600V
Ω
170ns 38A
Features and Benefits
• SuperFast body diode eliminates the need for external
diodes in ZVS applications.
• Lower Gate charge results in simpler drive requirements.
• Enhanced dv/dt capabilities offer improved ruggedness.
• Higher Gate voltage threshold offers improved noise immunity.
SUPER TO-247AC
Absolute Maximum Ratings
Parameter
Max.
38
Units
A
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
24
IDM
150
540
Pulsed Drain Current
PD @TC = 25°C
Power Dissipation
W
Linear Derating Factor
Gate-to-Source Voltage
4.3
±30
W/°C
V
VGS
dv/dt
TJ
Peak Diode Recovery dv/dt
Operating Junction and
13
V/ns
-55 to + 150
TSTG
Storage Temperature Range
°C
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
300 (1.6mm from case )
1.1(10)
N•m (lbf•in)
Diode Characteristics
Symbol
Parameter
Continuous Source Current
Min. Typ. Max. Units
––– ––– 38
Conditions
MOSFET symbol
D
I
I
S
(Body Diode)
Pulsed Source Current
A
showing the
integral reverse
G
––– ––– 150
SM
S
(Body Diode)
p-n junction diode.
V
t
T = 25°C, I = 38A, V = 0V
J S GS
Diode Forward Voltage
Reverse Recovery Time
––– –––
1.5
V
SD
T = 25°C, I = 38A
––– 170 250
––– 420 630
ns
rr
J
F
TJ = 125°C, di/dt = 100A/µs
Q
rr
T = 25°C, I = 38A, V = 0V
Reverse Recovery Charge
––– 830 1240 nC
––– 2600 3900
J
S
GS
TJ = 125°C, di/dt = 100A/µs
IRRM
T = 25°C
J
Reverse Recovery Current
Forward Turn-On Time
––– 9.1
14
A
t
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
on
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1
02/12/03