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IRFP26N60L PDF预览

IRFP26N60L

更新时间: 2024-11-20 05:39:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
8页 159K
描述
Power MOSFET

IRFP26N60L 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-247AC
针数:3Reach Compliance Code:compliant
风险等级:5.26雪崩能效等级(Eas):570 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):26 A
最大漏极电流 (ID):26 A最大漏源导通电阻:0.25 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247AC
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):470 W
最大脉冲漏极电流 (IDM):100 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRFP26N60L 数据手册

 浏览型号IRFP26N60L的Datasheet PDF文件第2页浏览型号IRFP26N60L的Datasheet PDF文件第3页浏览型号IRFP26N60L的Datasheet PDF文件第4页浏览型号IRFP26N60L的Datasheet PDF文件第5页浏览型号IRFP26N60L的Datasheet PDF文件第6页浏览型号IRFP26N60L的Datasheet PDF文件第7页 
IRFP26N60L, SiHFP26N60L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Superfast Body Diode Eliminates the Need for  
External Diodes in ZVS Applications  
PRODUCT SUMMARY  
VDS (V)  
600  
Available  
R
DS(on) (Ω)  
VGS = 10 V  
0.21  
RoHS*  
• Lower Gate Charge Results in Simpler Drive  
Requirements  
Qg (Max.) (nC)  
180  
61  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
85  
• Enhanced dV/dt Capabilities Offer Improved Ruggedness  
Configuration  
Single  
• Higher Gate Voltage Threshold Offers Improved Noise  
Immunity  
D
• Lead (Pb)-free Available  
TO-247  
APPLICATIONS  
G
• Zero Voltage Switching (SMPS)  
• Telecom and Server Power Supplies  
• Uninterruptible Power Suplies  
• Motor Control Applications  
S
D
S
N-Channel MOSFET  
G
ORDERING INFORMATION  
Package  
TO-247  
IRFP26N60LPbF  
SiHFP26N60L-E3  
IRFP26N60L  
Lead (Pb)-free  
SnPb  
SiHFP26N60L  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
600  
V
30  
T
C = 25 °C  
26  
Continuous Drain Current  
VGS at 10 V  
ID  
TC =100°C  
17  
A
Pulsed Drain Currenta  
IDM  
100  
Linear Derating Factor  
3.8  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
570  
26  
EAR  
47  
mJ  
W
Maximum Power Dissipation  
T
C = 25 °C  
PD  
470  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
21  
- 55 to + 150  
300d  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
°C  
for 10 s  
6-32 or M3 screw  
10  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 1.7 mH, RG = 25 Ω, IAS = 26 A, dV/dt = 21 V/ns (see fig. 12).  
c. ISD 26 A, dI/dt 480 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91218  
S-81264-Rev. B, 21-Jul-08  
www.vishay.com  
1

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