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IRFP264

更新时间: 2024-11-24 05:39:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 1568K
描述
Power MOSFET

IRFP264 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ObsoleteReach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.29
雪崩能效等级(Eas):1000 mJ外壳连接:DRAIN
配置:SINGLE最小漏源击穿电压:250 V
最大漏极电流 (Abs) (ID):38 A最大漏极电流 (ID):38 A
最大漏源导通电阻:0.075 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-247ACJESD-30 代码:R-PSFM-T3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):280 W
最大脉冲漏极电流 (IDM):150 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRFP264 数据手册

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IRFP264, SiHFP264  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
250  
• Repetitive Avalanche Rated  
• Isolated Central Mounting Hole  
• Fast Switching  
Available  
RDS(on) (Ω)  
Qg (Max.) (nC)  
Qgs (nC)  
VGS = 10 V  
0.075  
RoHS*  
210  
35  
COMPLIANT  
• Ease of Paralleling  
Q
gd (nC)  
98  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
Configuration  
Single  
D
TO-247  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The TO-247 package is preferred for commercial-industrial  
applications where higher power levels preclude the use of  
TO-220 devices. The TO-247 is similar but superior to the  
earlier TO-218 package because its isolated mounting hole.  
It also provides greater creepage distances between pins to  
meet the requirements of most safety specifications.  
S
D
S
N-Channel MOSFET  
G
ORDERING INFORMATION  
Package  
TO-247  
IRFP264PbF  
SiHFP264-E3  
IRFP264  
Lead (Pb)-free  
SnPb  
SiHFP264  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
250  
V
VGS  
20  
T
C = 25 °C  
38  
24  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
A
Pulsed Drain Currenta  
IDM  
150  
Linear Derating Factor  
2.2  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
1000  
38  
EAR  
28  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
280  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
4.8  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
10  
°C  
for 10 s  
6-32 or M3 screw  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 1.1 mH, RG = 25 Ω, IAS = 38 A (see fig. 12).  
c. ISD 38 A, dI/dt 210 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91217  
S-81264-Rev. A, 21-Jul-08  
www.vishay.com  
1

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