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IRFL014TR

更新时间: 2024-11-16 05:39:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 950K
描述
Power MOSFET

IRFL014TR 数据手册

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IRFL014, SiHFL014  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface Mount  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Fast Switching  
• Ease of Paralleling  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
RDS(on) (Ω)  
VGS = 10 V  
0.20  
RoHS*  
Qg (Max.) (nC)  
Qgs (nC)  
11  
3.1  
COMPLIANT  
Q
gd (nC)  
5.8  
Configuration  
Single  
D
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
SOT-223  
G
The SOT-223 package is designed for surface-mounting  
using vapor phase, infrared, or wave soldering techniques.  
Its unique package design allows for easy automatic  
pick-and-place as with other SOT or SOIC packages but has  
the added advantage of improved thermal performace due to  
an enlarged tab for heatsinking. Power dissipation of greater  
than 1.25 W is possible in a typical surface mount  
application.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
SOT-223  
SOT-223  
IRFL014PbF  
SiHFL014-E3  
IRFL014  
IRFL014TRPbFa  
SiHFL014T-E3a  
IRFL014TRa  
SiHFL014Ta  
Lead (Pb)-free  
SnPb  
SiHFL014  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
60  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
2.7  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC =100°C  
1.7  
A
Pulsed Drain Currenta  
IDM  
22  
Linear Derating Factor  
0.025  
0.017  
100  
W/°C  
mJ  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
EAS  
PD  
TC = 25 °C  
3.1  
W
TA = 25 °C  
2.0  
dV/dt  
4.5  
V/ns  
°C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 16 mH, RG = 25 Ω, IAS = 2.7 A (see fig. 12).  
c. ISD 10 A, dI/dt 90 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91191  
S-81369-Rev. A, 07-Jul-08  
www.vishay.com  
1

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