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IRF7335D1PBF PDF预览

IRF7335D1PBF

更新时间: 2024-11-13 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体肖特基二极管小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
12页 242K
描述
Dual FETKY Co-Packaged Dual MOSFET Plus Schottky Diode

IRF7335D1PBF 数据手册

 浏览型号IRF7335D1PBF的Datasheet PDF文件第2页浏览型号IRF7335D1PBF的Datasheet PDF文件第3页浏览型号IRF7335D1PBF的Datasheet PDF文件第4页浏览型号IRF7335D1PBF的Datasheet PDF文件第5页浏览型号IRF7335D1PBF的Datasheet PDF文件第6页浏览型号IRF7335D1PBF的Datasheet PDF文件第7页 
PD-95272  
IRF7335D1PbF  
Co-Pack Dual N-channel HEXFET® Power MOSFET  
and Schottky Diode  
Ideal for Synchronous Buck DC-DC  
Converters Up to 11A Peak Output  
Low Conduction Losses  
Low Switching Losses  
Low Vf Schottky Rectifier  
Lead-Free  
Dual FETKY™  
Co-Packaged Dual MOSFET Plus Schottky Diode  
Device Ratings (Typ.Values)  
Q2  
Q1  
and Schottky  
1
2
3
4
5
6
7
14  
D1  
D1  
S1, D2  
13 S1, D2  
12 S1, D2  
Q1  
RDS(on)  
QG  
13.4 mΩ  
13 nC  
5.5 nC  
1.0V  
9.6 mΩ  
18 nC  
6.4 nC  
0.43V  
G1  
G2  
S2  
S2  
S2  
11  
10 S1, D2  
S1, D2  
9
8
S1, D2  
S1, D2  
Qsw  
Q2  
VSD  
Description  
The FETKYfamily of Co-Pack HEXFET®MOSFETs and Schottky diodes offers the designer an innovative, board space  
saving solution for switching regulator and power management applications. Advanced HEXFET®MOSFETs combined  
with low forward drop Schottky results in an extremely efficient device suitable for a wide variety of portable electronics  
applications.  
The SO-14 has been modified through a customized leadframe for enhanced thermal characteristics and multiple die  
capability making it ideal in a variety of power applications. With these improvements multiple devices can be used in an  
application with dramatically reduced board space. Internal connections enable easier board layout design with reduced  
stray inductance.  
AbsoluteMaximumRatings  
Parameter  
Max.  
Units  
VDS  
Drain-Source Voltage  
30  
V
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V„  
Continuous Drain Current, VGS @ 10V„  
Pulsed Drain Current   
10  
8.1  
A
81  
2.0  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
W
Power Dissipationƒ  
1.3  
Linear Derating Factor  
0.02  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 12  
EAS (6 sigma)  
Single Pulse Avalanche Energy ꢀ  
Operating Junction and  
50  
mJ  
TJ  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
Max.  
Units  
RθJL  
Junction-to-Drain Lead  
20  
RθJA  
Junction-to-Ambient ƒ  
62.5  
°C/W  
Notes  through are on page 12  
08/16/06  

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