PD - 94391B
IRF7341Q
HEXFET® Power MOSFET
Typical Applications
• Anti-lock Braking Systems (ABS)
• Electronic Fuel Injection
• Air bag
VDSS
55V
RDS(on) max
0.050@VGS = 10V
0.065@VGS = 4.5V
ID
5.1A
Benefits
• Advanced Process Technology
• Dual N-Channel MOSFET
• Ultra Low On-Resistance
• 175°C Operating Temperature
• Repetitive Avalanche Allowed up to Tjmax
• Automotive [Q101] Qualified
4.42A
Description
1
2
3
4
8
S1
G1
S2
D1
Specifically designed for Automotive applications, these
HEXFET ® Power MOSFET’s in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
AutomotivequalifiedHEXFETPowerMOSFET’sarea175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These benefits com-
bine to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety
of other applications.
7
D1
6
D2
5
D2
G2
SO-8
Top View
The 175°C rating for the SO-8 package provides improved
thermal performance with increased safe operating area and
dual MOSFET die capability make it ideal in a variety of
power applications. This dual, surface mount SO-8 can
dramatically reduce board space and is also available in
Tape & Reel.
Absolute Maximum Ratings
Parameter
Max.
Units
VDS
Drain-Source Voltage
55
V
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
5.1
4.2
A
42
PD @TA = 25°C
PD @TA = 70°C
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
2.4
W
W
1.7
16
± 20
mW/°C
V
VGS
Gate-to-Source Voltage
EAS
Single Pulse Avalanche Energy
Avalanche Current
140
mJ
A
IAR
5.1
EAR
Repetitive Avalanche Energy
Junction and Storage Temperature Range
See Fig. 14, 15, 16
-55 to + 175
mJ
°C
TJ , TSTG
Thermal Resistance
Parameter
Max.
Units
RθJA
Maximum Junction-to-Ambient
62.5
°C/W
www.irf.com
1
02/15/05