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IRF7341Q PDF预览

IRF7341Q

更新时间: 2024-11-07 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
9页 157K
描述
HEXFET Power MOSFET

IRF7341Q 数据手册

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PD - 94391B  
IRF7341Q  
HEXFET® Power MOSFET  
Typical Applications  
Anti-lock Braking Systems (ABS)  
Electronic Fuel Injection  
Air bag  
VDSS  
55V  
RDS(on) max  
0.050@VGS = 10V  
0.065@VGS = 4.5V  
ID  
5.1A  
Benefits  
Advanced Process Technology  
Dual N-Channel MOSFET  
Ultra Low On-Resistance  
175°C Operating Temperature  
Repetitive Avalanche Allowed up to Tjmax  
Automotive [Q101] Qualified  
4.42A  
Description  
1
2
3
4
8
S1  
G1  
S2  
D1  
Specifically designed for Automotive applications, these  
HEXFET ® Power MOSFET’s in a Dual SO-8 package utilize  
the lastest processing techniques to achieve extremely low  
on-resistance per silicon area. Additional features of these  
AutomotivequalifiedHEXFETPowerMOSFET’sarea175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating. These benefits com-  
bine to make this design an extremely efficient and reliable  
device for use in Automotive applications and a wide variety  
of other applications.  
7
D1  
6
D2  
5
D2  
G2  
SO-8  
Top View  
The 175°C rating for the SO-8 package provides improved  
thermal performance with increased safe operating area and  
dual MOSFET die capability make it ideal in a variety of  
power applications. This dual, surface mount SO-8 can  
dramatically reduce board space and is also available in  
Tape & Reel.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain-Source Voltage  
55  
V
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
5.1  
4.2  
A
42  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipationƒ  
Maximum Power Dissipationƒ  
Linear Derating Factor  
2.4  
W
W
1.7  
16  
± 20  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
EAS  
Single Pulse Avalanche Energy‚  
Avalanche Current  
140  
mJ  
A
IAR  
5.1  
EAR  
Repetitive Avalanche Energy  
Junction and Storage Temperature Range  
See Fig. 14, 15, 16  
-55 to + 175  
mJ  
°C  
TJ , TSTG  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient ƒ  
62.5  
°C/W  
www.irf.com  
1
02/15/05  

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