PD - 96968
IRF6637
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l Lead and Bromide Free
VDSS
VGS
RDS(on)
RDS(on)
l Low Profile (<0.7 mm)
5.7mΩ@ 10V 8.2mΩ@ 4.5V
30V max ±20V max
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
l Optimized for High Frequency Switching
l Ideal for CPU Core DC-DC Converters
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
11nC
4.0nC 1.0nC
20nC
9.9nC
1.8V
l Optimized for both Sync.FET and some Control FET
application
l Low Conduction and Switching Losses
l Compatible with existing Surface Mount Techniques
DirectFET ISOMETRIC
MP
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
MP
Description
The IRF6637 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the
lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6637 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching
losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors
operating at higher frequencies. The IRF6637 has been optimized for parameters that are critical in synchronous buck operating from 12 volt
buss converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
Max.
30
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
14
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
11
@ TA = 70°C
@ TC = 25°C
A
59
110
31
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
11
25
20
15
10
5
12
10
8
I = 11A
D
I
= 14A
V
= 24V
D
DS
VDS= 15V
6
T
= 125°C
J
4
2
T
= 25°C
J
0
2.0
4.0
6.0
8.0
10.0
0
4
8
12
16
20
24
V
, Gate-to-Source Voltage (V)
GS
Fig 1. Typical On-Resistance Vs. Gate Voltage
Q
Total Gate Charge (nC)
G
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.52mH, RG = 25Ω, IAS = 11A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
2/15/05