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IRF6603PBF PDF预览

IRF6603PBF

更新时间: 2024-11-27 19:54:43
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
12页 258K
描述
Power Field-Effect Transistor, 27A I(D), 30V, 0.0034ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS AND REACH COMPLIANT, MT, ISOMETRIC-3

IRF6603PBF 数据手册

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PD - 94364F  
IRF6603  
HEXFET® Power MOSFET  
VDSS  
30V  
RDS(on) max  
3.4m@VGS = 10V  
5.5m@VGS = 4.5V  
Qg(typ.)  
l Application Specific MOSFETs  
l Ideal for CPU Core DC-DC Converters  
l Low Conduction Losses  
48nC  
l High Cdv/dt Immunity  
l Low Profile (<0.7 mm)  
l Dual Sided Cooling Compatible  
l Compatible with existing Surface Mount  
Techniques  
DirectFET™ISOMETRIC  
MT  
Applicable DirectFET Outline and Substrate Outline (see p.9,10 for details)  
SQ SX ST MQ MX MT  
Description  
The IRF6603 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the  
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible  
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering  
techniques, when application note AN-1035 is followed regarding the manufacturing methods and process. The DirectFET package  
allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.  
The IRF6603 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and  
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation  
of processors operating at higher frequencies. The IRF6603 has been optimized for parameters that are critical in synchronous buck  
converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6603 offers particularly low Rds(on) and high Cdv/  
dt immunity for synchronous FET applications.  
Absolute Maximum Ratings  
Parameter  
Drain-to-Source Voltage  
Max.  
30  
Units  
V
VDS  
V
Gate-to-Source Voltage  
+20/-12  
27  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ TA = 25°C  
A
D
D
D
@ TA = 70°C  
@ TC = 25°C  
22  
92  
200  
3.6  
DM  
Power Dissipation  
P
P
P
@TA = 25°C  
@TA = 70°C  
@TC = 25°C  
D
D
D
Power Dissipation  
2.3  
W
Power Dissipation  
42  
Linear Derating Factor  
Operating Junction and  
0.029  
-40 to + 150  
W/°C  
°C  
T
T
J
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Junction-to-Ambient  
Junction-to-Ambient  
Typ.  
–––  
12.5  
20  
Max.  
35  
Units  
Rθ  
Rθ  
JA  
JA  
–––  
–––  
3.0  
Junction-to-Ambient  
Junction-to-Case  
RθJA  
°C/W  
RθJC  
–––  
1.0  
RθJ-PCB  
Junction-to-PCB Mounted  
–––  
Notes  through ˆare on page 11  
www.irf.com  
1
12/22/05  

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