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IRF6612 PDF预览

IRF6612

更新时间: 2024-01-08 00:40:54
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 199K
描述
HEXFET Power MOSFET

IRF6612 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, ISOMETRIC-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.7
Is Samacsys:N雪崩能效等级(Eas):37 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):24 A
最大漏源导通电阻:0.0033 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBCC-N3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):190 A认证状态:Not Qualified
表面贴装:YES端子面层:TIN SILVER COPPER
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF6612 数据手册

 浏览型号IRF6612的Datasheet PDF文件第2页浏览型号IRF6612的Datasheet PDF文件第3页浏览型号IRF6612的Datasheet PDF文件第4页浏览型号IRF6612的Datasheet PDF文件第5页浏览型号IRF6612的Datasheet PDF文件第6页浏览型号IRF6612的Datasheet PDF文件第7页 
PD - 95842  
IRF6612/IRF6612TR1  
HEXFET® Power MOSFET  
VDSS  
30V  
RDS(on) max  
3.3m@VGS = 10V  
4.4m@VGS = 4.5V  
Qg(typ.)  
l Application Specific MOSFETs  
l Ideal for CPU Core DC-DC Converters  
l Low Conduction Losses  
30nC  
l Low Switching Losses  
l Low Profile (<0.7 mm)  
l Dual Sided Cooling Compatible  
l Compatible with existing Surface Mount  
Techniques  
DirectFET™ ISOMETRIC  
MX  
Applicable DirectFET Package/Layout Pad (see p.8,9 for details)  
MX  
SQ  
SX  
ST  
MQ  
MT  
Description  
The IRF6612 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the  
lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with  
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering tech-  
niques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows  
dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.  
The IRF6612 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switch-  
ing losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of  
processors operating at higher frequencies. The IRF6612 has been optimized for parameters that are critical in synchronous buck convert-  
ers including Rds(on), gate charge and Cdv/dt-induced turn on immunity to minimize losses in the synchronous FET socket.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
30  
±20  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
V
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
136  
I
I
I
I
@ TC = 25°C  
D
D
D
24  
@ TA = 25°C  
@ TA = 70°C  
A
19  
190  
DM  
2.8  
P
P
P
@TA = 25°C  
@TA = 70°C  
@TC = 25°C  
Power Dissipation  
D
D
D
1.8  
Power Dissipation  
W
89  
Power Dissipation  
0.022  
-40 to + 150  
Linear Derating Factor  
W/°C  
°C  
T
Operating Junction and  
J
Storage Temperature Range  
T
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
12.5  
20  
Max.  
45  
Units  
RθJA  
Junction-to-Ambient  
RθJA  
Junction-to-Ambient  
Junction-to-Ambient  
Junction-to-Case  
–––  
–––  
1.4  
RθJA  
°C/W  
RθJC  
–––  
1.0  
RθJ-PCB  
Junction-to-PCB Mounted  
–––  
Notes  through ˆ are on page 10  
www.irf.com  
1
02/02/04  

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