PD -95847B
IRF6617
DirectFET Power MOSFET
l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
VDSS
30V
RDS(on) max
Qg(typ.)
8.1m
Ω@VGS = 10V
11nC
l Low Switching Losses
10.3mΩ@VGS = 4.5V
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Compatible with Existing Surface Mount Techniques
DirectFET ISOMETRIC
ST
Applicable DirectFET Outline and Substrate Outline (see p.7, 8 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF6617 combines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to
achieve the lowest on-state resistance in a package that has the footprint of a Micro8™ and only 0.7 mm profile. The DirectFET
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase,
infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing meth-
ods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improv-
ing previous best thermal resistance by 80%.
The IRF6617 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the
latest generation of processors operating at higher frequencies. The IRF6617 has been optimized for parameters that are
critical in synchronous buck converters including RDS(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
Max.
Parameter
Units
VDS
30
Drain-to-Source Voltage
V
±20
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
55
I
I
I
I
@ TC = 25°C
D
D
D
14
@ TA = 25°C
@ TA = 70°C
A
11
120
DM
42
P
P
P
@TC = 25°C
@TA = 25°C
@TA = 70°C
Power Dissipation
D
D
D
2.1
1.4
Power Dissipation
W
Power Dissipation
EAS
IAR
27
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
12
0.017
-40 to + 150
Linear Derating Factor
W/°C
°C
T
T
Operating Junction and
J
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
Max.
58
Units
RθJA
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
RθJA
–––
–––
3.0
RθJA
°C/W
RθJC
–––
1.0
RθJ-PCB
Junction-to-PCB Mounted
–––
Notes through are on page 2
www.irf.com
1
11/3/05