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IRF6617TR1PBF

更新时间: 2024-09-30 19:56:43
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
9页 215K
描述
Power Field-Effect Transistor, 14A I(D), 30V, 0.0081ohm, 1-Element, N-Channel, Silicon, Metal-Oxide Semiconductor FET, ROHS COMPLIANT, ISOMETRIC-3

IRF6617TR1PBF 数据手册

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PD -95847B  
IRF6617  
DirectFET™ Power MOSFET  
l Application Specific MOSFETs  
l Ideal for CPU Core DC-DC Converters  
l Low Conduction Losses  
VDSS  
30V  
RDS(on) max  
Qg(typ.)  
8.1m  
@VGS = 10V  
11nC  
l Low Switching Losses  
10.3m@VGS = 4.5V  
l Low Profile (<0.7 mm)  
l Dual Sided Cooling Compatible  
l Compatible with Existing Surface Mount Techniques  
DirectFET™ ISOMETRIC  
ST  
Applicable DirectFET Outline and Substrate Outline (see p.7, 8 for details)  
SQ  
SX  
ST  
MQ  
MX  
MT  
Description  
The IRF6617 combines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to  
achieve the lowest on-state resistance in a package that has the footprint of a Micro8™ and only 0.7 mm profile. The DirectFET  
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase,  
infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing meth-  
ods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improv-  
ing previous best thermal resistance by 80%.  
The IRF6617 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction  
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the  
latest generation of processors operating at higher frequencies. The IRF6617 has been optimized for parameters that are  
critical in synchronous buck converters including RDS(on) and gate charge to minimize losses in the control FET socket.  
Absolute Maximum Ratings  
Max.  
Parameter  
Units  
VDS  
30  
Drain-to-Source Voltage  
V
±20  
V
Gate-to-Source Voltage  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
55  
I
I
I
I
@ TC = 25°C  
D
D
D
14  
@ TA = 25°C  
@ TA = 70°C  
A
11  
120  
DM  
42  
P
P
P
@TC = 25°C  
@TA = 25°C  
@TA = 70°C  
Power Dissipation  
D
D
D
2.1  
1.4  
Power Dissipation  
W
Power Dissipation  
EAS  
IAR  
27  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
12  
0.017  
-40 to + 150  
Linear Derating Factor  
W/°C  
°C  
T
T
Operating Junction and  
J
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
12.5  
20  
Max.  
58  
Units  
RθJA  
Junction-to-Ambient  
Junction-to-Ambient  
Junction-to-Ambient  
Junction-to-Case  
RθJA  
–––  
–––  
3.0  
RθJA  
°C/W  
RθJC  
–––  
1.0  
RθJ-PCB  
Junction-to-PCB Mounted  
–––  
Notes  through ˆare on page 2  
www.irf.com  
1
11/3/05  

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