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IRF6618TR1 PDF预览

IRF6618TR1

更新时间: 2024-09-29 22:25:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
10页 231K
描述
Power MOSFET

IRF6618TR1 数据手册

 浏览型号IRF6618TR1的Datasheet PDF文件第2页浏览型号IRF6618TR1的Datasheet PDF文件第3页浏览型号IRF6618TR1的Datasheet PDF文件第4页浏览型号IRF6618TR1的Datasheet PDF文件第5页浏览型号IRF6618TR1的Datasheet PDF文件第6页浏览型号IRF6618TR1的Datasheet PDF文件第7页 
PD - 95822A  
IRF6609  
HEXFET® Power MOSFET  
VDSS  
20V  
RDS(on) max  
2.0m@VGS = 10V  
2.6m@VGS = 4.5V  
Qg  
46nC  
l Low Conduction Losses  
l Low Switching Losses  
l Ideal Synchronous Rectifier MOSFET  
l Low Profile (<0.7 mm)  
l Dual Sided Cooling Compatible  
l Compatible with existing Surface Mount  
Techniques  
DirectFET™ISOMETRIC  
MT  
Applicable DirectFET Outline and Substrate Outline (see p.8,9 for details)  
SQ SX ST MQ MX MT  
Description  
The IRF6609 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the  
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible  
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering  
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package  
allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.  
The IRF6609 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and  
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation  
of processors operating at higher frequencies. The IRF6609 has been optimized for parameters that are critical in synchronous buck  
operating from 12 volt buss converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6609 offers  
particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications.  
Absolute Maximum Ratings  
Parameter  
Drain-to-Source Voltage  
Max.  
20  
Units  
V
VDS  
V
Gate-to-Source Voltage  
±20  
150  
31  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ TC = 25°C  
D
D
D
@ TA = 25°C  
@ TA = 70°C  
A
25  
250  
2.8  
1.8  
89  
DM  
Power Dissipation  
P
P
P
@TA = 25°C  
@TA = 70°C  
@TC = 25°C  
D
D
D
Power Dissipation  
W
Power Dissipation  
Linear Derating Factor  
Operating Junction and  
0.022  
-40 to + 150  
W/°C  
°C  
T
J
T
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Junction-to-Ambient  
Junction-to-Ambient  
Typ.  
–––  
12.5  
20  
Max.  
45  
Units  
RθJA  
RθJA  
–––  
–––  
1.4  
Junction-to-Ambient  
Junction-to-Case  
RθJA  
°C/W  
RθJC  
–––  
1.0  
RθJ-PCB  
Junction-to-PCB Mounted  
–––  
Notes  through ˆare on page 10  
www.irf.com  
1 11/10/04  

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