PD - 94727B
IRF6608
HEXFET® Power MOSFET
l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
VDSS
30V
RDS(on) max
Qg
9.0mΩ@VGS = 10V
16nC
l Low Switching Losses
11mΩ@VGS = 4.5V
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
DirectFET ISOMETRIC
ST
Applicable DirectFET Outline and Substrate Outline (see p.7, 8 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF6608 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase,
infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and
processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous
best thermal resistance by 80%.
The IRF6608 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest
generation of processors operating at higher frequencies. The IRF6608 has been optimized for parameters that are critical in
synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6608 has been
optimized for parameters that are critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in
the control FET socket.
Absolute Maximum Ratings
Max.
Parameter
Units
VDS
30
Drain-to-Source Voltage
V
±12
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
55
I @ TC = 25°C
D
13
10
I @ TA = 25°C
A
D
I @ TA = 70°C
D
100
I
Pulsed Drain Current
c
DM
2.1
Power Dissipation
Power Dissipation
Power Dissipation
g
g
P @TA = 25°C
D
1.4
P @TA = 70°C
W
D
42
P @TC = 25°C
D
0.017
-40 to + 150
Linear Derating Factor
W/°C
°C
T
T
Operating Junction and
Storage Temperature Range
J
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
Max.
58
Units
RθJA
fj
Junction-to-Ambient
Junction-to-Ambient gj
hj
RθJA
–––
–––
3.0
RθJA
Junction-to-Ambient
°C/W
RθJC
Junction-to-Case ij
–––
1.0
RθJ-PCB
Junction-to-PCB Mounted
–––
Notes through are on page 2
www.irf.com
1
3/31/04