PD - 94365B
IRF6604
HEXFET® Power MOSFET
l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
VDSS
30V
RDS(on) max
11.5mΩ@VGS = 7.0V
13mΩ@VGS = 4.5V
Qg
17nC
l Low Switching Losses
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount
Techniques
DirectFET ISOMETRIC
Description
The IRF6604 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging
to achieve the lowest on-state resistance charge product in a package that has the footprint of an SO-8 and only 0.7 mm
profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly
equipment and vapor phase, infra-red or convection soldering techniques. The DirectFET package allows dual sided cooling
to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6604 balances both low resistance and low charge along with ultra low package inductance to reduce both conduc-
tion and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power
the latest generation of processors operating at higher frequencies. The IRF6604 has been optimized for parameters that
are critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
Parameter
Max.
30
Units
V
VDS
Drain-to-Source Voltage
V
Gate-to-Source Voltage
±12
49
GS
Continuous Drain Current, VGS @ 7.0V
Continuous Drain Current, VGS @ 7.0V
Continuous Drain Current, VGS @ 7.0V
Pulsed Drain Current
I
I
I
I
@ TC = 25°C
D
D
D
@ TA = 25°C
@ TA = 70°C
12
A
9.2
92
DM
Power Dissipation
P
P
P
@TA = 25°C
@TA = 70°C
@TC = 25°C
2.3
1.5
42
D
D
D
Power Dissipation
W
Power Dissipation
Linear Derating Factor
Operating Junction and
0.018
-40 to + 150
W/°C
°C
T
J
T
Storage Temperature Range
STG
Thermal Resistance
Parameter
Junction-to-Ambient
Junction-to-Ambient
Typ.
–––
12.5
20
Max.
55
Units
RθJA
RθJA
–––
–––
3.0
Junction-to-Ambient
Junction-to-Case
RθJA
°C/W
RθJC
–––
1.0
RθJ-PCB
Junction-to-PCB Mounted
–––
Notes through are on page 11
www.irf.com
1
6/11/03