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IRF6604PBF PDF预览

IRF6604PBF

更新时间: 2024-11-27 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
11页 205K
描述
Power Field-Effect Transistor, 12A I(D), 30V, 0.0115ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS AND REACH COMPLIANT, MQ, ISOMETRIC-3

IRF6604PBF 数据手册

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PD - 94365B  
IRF6604  
HEXFET® Power MOSFET  
l Application Specific MOSFETs  
l Ideal for CPU Core DC-DC Converters  
l Low Conduction Losses  
VDSS  
30V  
RDS(on) max  
11.5m@VGS = 7.0V  
13m@VGS = 4.5V  
Qg  
17nC  
l Low Switching Losses  
l Low Profile (<0.7 mm)  
l Dual Sided Cooling Compatible  
l Compatible with existing Surface Mount  
Techniques  
DirectFET™ ISOMETRIC  
Description  
The IRF6604 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging  
to achieve the lowest on-state resistance charge product in a package that has the footprint of an SO-8 and only 0.7 mm  
profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly  
equipment and vapor phase, infra-red or convection soldering techniques. The DirectFET package allows dual sided cooling  
to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.  
The IRF6604 balances both low resistance and low charge along with ultra low package inductance to reduce both conduc-  
tion and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power  
the latest generation of processors operating at higher frequencies. The IRF6604 has been optimized for parameters that  
are critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in the control FET socket.  
Absolute Maximum Ratings  
Parameter  
Max.  
30  
Units  
V
VDS  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
±12  
49  
GS  
Continuous Drain Current, VGS @ 7.0V  
Continuous Drain Current, VGS @ 7.0V  
Continuous Drain Current, VGS @ 7.0V  
Pulsed Drain Current  
I
I
I
I
@ TC = 25°C  
D
D
D
@ TA = 25°C  
@ TA = 70°C  
12  
A
9.2  
92  
DM  
Power Dissipation  
P
P
P
@TA = 25°C  
@TA = 70°C  
@TC = 25°C  
2.3  
1.5  
42  
D
D
D
Power Dissipation  
W
Power Dissipation  
Linear Derating Factor  
Operating Junction and  
0.018  
-40 to + 150  
W/°C  
°C  
T
J
T
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Junction-to-Ambient  
Junction-to-Ambient  
Typ.  
–––  
12.5  
20  
Max.  
55  
Units  
RθJA  
RθJA  
–––  
–––  
3.0  
Junction-to-Ambient  
Junction-to-Case  
RθJA  
°C/W  
RθJC  
–––  
1.0  
RθJ-PCB  
Junction-to-PCB Mounted  
–––  
Notes  through ‡are on page 11  
www.irf.com  
1
6/11/03  

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