PD - 94366C
IRF6601
DirectFETTM Power MOSFET
l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
l Low Switching Losses
l Low Profile (<0.7 mm)
VDSS
20V
RDS(on) max
3.8mΩ@VGS = 10V
5.0mΩ@VGS = 4.5V
ID
26A
21A
l Dual Sided Cooling Compatible
l Compatible with exisiting Surface Mount
Techniques
DirectFET ISOMETRIC
Description
The IRF6601 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging
toachievetheloweston-stateresistanceinapackagethathasthefootprintofanSO-8andonly0.7mmprofile. TheDirectFET
packageiscompatiblewithexistinglayoutgeometriesusedinpowerapplications,PCBassemblyequipmentandvaporphase,
infra-red or convection soldering techniques. The DirectFET package allows dual sided cooling to maximize thermal transfer
in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6601 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the
latest generation of processors operating at higher frequencies. The IRF6601 has been optimized for parameters that are
critical in synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6601
offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications.
Absolute Maximum Ratings
Parameter
Max.
Units
VDS
Drain- Source Voltage
20
V
ID @ TC = 25°C
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
85
26
20
A
200
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
Power Dissipation
3.6
W
Power Dissipation
2.3
Power Dissipation
42
28
Linear Derating Factor
mW/°C
VGS
Gate-to-Source Voltage
±20
V
TJ, TSTG
Junction and Storage Temperature Range
-55 to + 150
°C
Thermal Resistance
Symbol
RθJA
Parameter
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambientꢀ
Junction-to-Case
Typ.
–––
–––
–––
–––
–––
Max.
35
Units
RθJA
12.5
20
RθJA
°C/W
RθJC
3.0
RθJ-PCB
Junction-to-PCB mounted
1.0
www.irf.com
1
3/25/02