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IRF6601 PDF预览

IRF6601

更新时间: 2024-11-26 22:31:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 131K
描述
DirectFET⑩ Power MOSFET(Vdss=20V)

IRF6601 数据手册

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PD - 94366C  
IRF6601  
DirectFETTM Power MOSFET  
l Application Specific MOSFETs  
l Ideal for CPU Core DC-DC Converters  
l Low Conduction Losses  
l Low Switching Losses  
l Low Profile (<0.7 mm)  
VDSS  
20V  
RDS(on) max  
3.8m@VGS = 10V  
5.0m@VGS = 4.5V  
ID  
26A  
21A  
l Dual Sided Cooling Compatible  
l Compatible with exisiting Surface Mount  
Techniques  
DirectFET™ ISOMETRIC  
Description  
The IRF6601 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging  
toachievetheloweston-stateresistanceinapackagethathasthefootprintofanSO-8andonly0.7mmprofile. TheDirectFET  
packageiscompatiblewithexistinglayoutgeometriesusedinpowerapplications,PCBassemblyequipmentandvaporphase,  
infra-red or convection soldering techniques. The DirectFET package allows dual sided cooling to maximize thermal transfer  
in power systems, IMPROVING previous best thermal resistance by 80%.  
The IRF6601 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction  
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the  
latest generation of processors operating at higher frequencies. The IRF6601 has been optimized for parameters that are  
critical in synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6601  
offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain- Source Voltage  
20  
V
ID @ TC = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
85  
26  
20  
A
200  
PD @TA = 25°C  
PD @TA = 70°C  
PD @TC = 25°C  
Power Dissipation  
3.6  
W
Power Dissipation  
2.3  
Power Dissipation  
42  
28  
Linear Derating Factor  
mW/°C  
VGS  
Gate-to-Source Voltage  
±20  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Symbol  
RθJA  
Parameter  
Junction-to-Ambientƒ  
Junction-to-Ambient„  
Junction-to-Ambientꢀ  
Junction-to-Case†  
Typ.  
–––  
–––  
–––  
–––  
–––  
Max.  
35  
Units  
RθJA  
12.5  
20  
RθJA  
°C/W  
RθJC  
3.0  
RθJ-PCB  
Junction-to-PCB mounted  
1.0  
www.irf.com  
1
3/25/02  

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