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FGA70N33BTDTU PDF预览

FGA70N33BTDTU

更新时间: 2024-11-10 06:59:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率控制光电二极管双极性晶体管局域网
页数 文件大小 规格书
9页 750K
描述
330V, 70A PDP IGBT

FGA70N33BTDTU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-3P
包装说明:ROHS COMPLIANT, SC-65, TO-3PN, 3 PIN针数:3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.81
集电极-发射极最大电压:330 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:4.3 V门极-发射极最大电压:30 V
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):149 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):316 ns标称接通时间 (ton):41 ns
Base Number Matches:1

FGA70N33BTDTU 数据手册

 浏览型号FGA70N33BTDTU的Datasheet PDF文件第2页浏览型号FGA70N33BTDTU的Datasheet PDF文件第3页浏览型号FGA70N33BTDTU的Datasheet PDF文件第4页浏览型号FGA70N33BTDTU的Datasheet PDF文件第5页浏览型号FGA70N33BTDTU的Datasheet PDF文件第6页浏览型号FGA70N33BTDTU的Datasheet PDF文件第7页 
November 2008  
FGA70N33BTD  
tm  
330V, 70A PDP IGBT  
Features  
General Description  
High current capability  
Using Novel Trench IGBT Technology, Fairchild’s new series of  
trench IGBTs offer the optimum performance for PDP  
applications where low conduction and switching losses are  
essential.  
Low saturation voltage: VCE(sat) =1.7V @ IC = 70A  
High input impedance  
Fast switching  
RoHS Compliant  
Applications  
PDP System  
C
G
TO-3P  
E
G
C
E
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Description  
Ratings  
330  
Units  
VCES  
Collector to Emitter Voltage  
V
V
A
VGES  
Gate to Emitter Voltage  
Pulsed Collector Current  
± 30  
@ TC = 25oC  
ICpulse(1)  
*
160  
@ TC = 25oC  
@ TC = 25oC  
@ TC = 100oC  
IC pulse(2)  
*
Pulsed Collector Current  
220  
A
Maximum Power Dissipation  
149  
60  
W
W
V
PD  
Maximum Power Dissipation  
VRRM  
IF(AV)  
IFSM  
Peak Repetitive Reverse Voltage of Diode  
Average Rectified Forward Current of diode @ TC = 100oC  
330  
10  
A
Non-repetitive Peak Surge Current of diode  
60Hz Single Half-Sine wave  
100  
A
TJ, Tstg  
TL  
Operating Junction Temperature and Storage Temperrature  
-55 to +150  
300  
oC  
oC  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
0.84  
1.57  
40  
Units  
oC/W  
oC/W  
oC/W  
RθJC(IGBT)  
RθJC(Diode)  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
--  
--  
--  
Notes:  
1: Repetitive test , Pulse width=100usec , Duty=0.1  
2: Half Sine Wave, D< 0.01, pluse width < 5usec  
*I _pulse limited by max Tj  
C
©2008 Fairchild Semiconductor Corporation  
FGA70N33BTD Rev. A  
1
www.fairchildsemi.com  

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