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FGA90N33ATTU PDF预览

FGA90N33ATTU

更新时间: 2024-09-19 21:22:11
品牌 Logo 应用领域
安森美 - ONSEMI 双极性晶体管
页数 文件大小 规格书
8页 621K
描述
Discrete IGBT, TO-3PN 3L, 3600-RAIL

FGA90N33ATTU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:compliant
风险等级:5.83Base Number Matches:1

FGA90N33ATTU 数据手册

 浏览型号FGA90N33ATTU的Datasheet PDF文件第2页浏览型号FGA90N33ATTU的Datasheet PDF文件第3页浏览型号FGA90N33ATTU的Datasheet PDF文件第4页浏览型号FGA90N33ATTU的Datasheet PDF文件第5页浏览型号FGA90N33ATTU的Datasheet PDF文件第6页浏览型号FGA90N33ATTU的Datasheet PDF文件第7页 
April 2008  
FGA90N33AT  
tm  
330V, 90A PDP Trench IGBT  
Features  
General Description  
High current capability  
Using Novel Trench IGBT Technology, Fairchild’s new series of  
trench IGBTs offer the optimum performance for PDP applica-  
tions where low conduction and switching losses are essential.  
Low saturation voltage: VCE(sat) =1.1V @ IC = 20A  
High input impedance  
Fast switching  
RoHS compliant  
Applications  
PDP System  
C
G
TO-3P  
G
C
E
E
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
330  
Units  
VCES  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
Collector Current  
V
V
A
A
A
VGES  
± 30  
IC  
@ TC = 25oC  
@ TC = 25oC  
90  
IC pulse(1)  
IC pulse(2)  
Pulsed Collector Current  
Pulsed Collector Current  
220  
@ TC = 25oC  
@ TC = 25oC  
@ TC = 100oC  
330  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
223  
89  
W
W
oC  
oC  
PD  
TJ  
-55 to +150  
-55 to +150  
Tstg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
oC  
TL  
300  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
0.56  
40  
Units  
oC/W  
oC/W  
RθJC(IGBT)  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
-
-
Notes:  
(1) Repetitive test , Pulse width=100usec , Duty=0.1  
(2) Half sine wave , D<0.01, Pulse width<5usec  
*I pluse limited by max Tj  
C
©2008 Fairchild Semiconductor Corporation  
FGA90N33AT Rev. A  
1
www.fairchildsemi.com  

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