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FGAF40N60UFD PDF预览

FGAF40N60UFD

更新时间: 2024-11-07 22:31:55
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
8页 584K
描述
Ultrafast IGBT

FGAF40N60UFD 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-3PF包装说明:FLANGE MOUNT, R-PSFM-T3
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.63Is Samacsys:N
外壳连接:ISOLATED最大集电极电流 (IC):40 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:6.5 V门极-发射极最大电压:20 V
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):190 ns标称接通时间 (ton):67 ns
Base Number Matches:1

FGAF40N60UFD 数据手册

 浏览型号FGAF40N60UFD的Datasheet PDF文件第2页浏览型号FGAF40N60UFD的Datasheet PDF文件第3页浏览型号FGAF40N60UFD的Datasheet PDF文件第4页浏览型号FGAF40N60UFD的Datasheet PDF文件第5页浏览型号FGAF40N60UFD的Datasheet PDF文件第6页浏览型号FGAF40N60UFD的Datasheet PDF文件第7页 
IGBT  
FGAF40N60UFD  
Ultrafast IGBT  
General Description  
Features  
Fairchild's UFD series of Insulated Gate Bipolar Transistors  
(IGBTs) provides low conduction and switching losses.  
The UFD series is designed for applications such as motor  
control and general inverters where high speed switching is  
a required feature.  
High speed switching  
Low saturation voltage : V  
High input impedance  
= 2.3 V @ I = 20A  
CE(sat)  
C
CO-PAK, IGBT with FRD : t = 50ns (typ.)  
rr  
Applications  
AC & DC motor controls, general purpose inverters, robotics, and servo controls.  
C
E
G
TO-3PF  
G
C
E
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Description  
Collector-Emitter Voltage  
FGAF40N60UFD  
Units  
V
V
V
600  
± 20  
CES  
GES  
Gate-Emitter Voltage  
V
Collector Current  
@ T  
=
25°C  
40  
A
C
I
C
Collector Current  
@ T = 100°C  
20  
A
C
I
I
I
Pulsed Collector Current  
160  
A
CM (1)  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from Case for 5 Seconds  
@ T = 100°C  
15  
A
F
C
160  
A
FM  
P
@ T  
=
25°C  
100  
W
W
°C  
°C  
D
C
@ T = 100°C  
40  
C
T
-55 to +150  
-55 to +150  
J
T
stg  
T
300  
°C  
L
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Case  
Typ.  
--  
Max.  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
(IGBT)  
1.2  
2.6  
40  
θJC  
θJC  
θJA  
(DIODE)  
--  
Thermal Resistance, Junction-to-Ambient  
--  
©2004 Fairchild Semiconductor Corporation  
FGAF40N60UFD Rev. A  

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