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FDP090N10 PDF预览

FDP090N10

更新时间: 2024-11-23 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲PC局域网
页数 文件大小 规格书
8页 508K
描述
N-Channel PowerTrench㈢ MOSFET 100V, 75A, 9mヘ

FDP090N10 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:4.47
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:167162Samacsys Pin Count:3
Samacsys Part Category:TransistorSamacsys Package Category:Transistor Outline, Vertical
Samacsys Footprint Name:TO-220-ren2Samacsys Released Date:2016-04-12 06:51:27
Is Samacsys:N雪崩能效等级(Eas):309 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (ID):75 A最大漏源导通电阻:0.009 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):208 W
最大脉冲漏极电流 (IDM):300 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDP090N10 数据手册

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January 2008  
FDP090N10  
N-Channel PowerTrench MOSFET  
100V, 75A, 9mΩ  
tm  
®
Features  
General Description  
RDS(on) = 7.2m( Typ.) @ VGS = 10V, ID = 75A  
This N-Channel MOSFET is producedusing Fairchild Semicon-  
ductor’s advanced PowerTrench process that has been espe-  
cially tailored to minimize the on-state resistance and yet  
maintain superior switching performance.  
Fast switching speed  
Low gate charge  
High performance trench technology for extremely low RDS(on)  
High power and current handling capability  
RoHS compliant  
Application  
DC to DC convertors / Synchronous Rectification  
D
G
TO-220  
G
S
D
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
ID  
Parameter  
Ratings  
100  
Units  
V
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
±20  
V
-Continuous (TC = 85oC)  
- Pulsed  
75  
A
IDM  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
300  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalance Current  
309  
mJ  
A
75  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
20.8  
5.6  
mJ  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
208  
PD  
Power Dissipation  
1.39  
-55 to +175  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Ratings  
0.72  
Units  
RθJC  
RθCS  
RθJA  
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
0.5  
oC/W  
62.5  
©2008 Fairchild Semiconductor Corporation  
FDP090N10 Rev. A  
1
www.fairchildsemi.com  

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