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FDP12N50F PDF预览

FDP12N50F

更新时间: 2024-11-26 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 697K
描述
N-Channel MOSFET 500V, 11.5A, 0.7ヘ

FDP12N50F 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:ROHS COMPLIANT, TO-220, 3 PIN
针数:3Reach Compliance Code:compliant
HTS代码:8541.29.00.95风险等级:5.75
Is Samacsys:N雪崩能效等级(Eas):456 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):11.5 A最大漏极电流 (ID):11.5 A
最大漏源导通电阻:0.7 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):165 W
最大脉冲漏极电流 (IDM):46 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDP12N50F 数据手册

 浏览型号FDP12N50F的Datasheet PDF文件第2页浏览型号FDP12N50F的Datasheet PDF文件第3页浏览型号FDP12N50F的Datasheet PDF文件第4页浏览型号FDP12N50F的Datasheet PDF文件第5页浏览型号FDP12N50F的Datasheet PDF文件第6页浏览型号FDP12N50F的Datasheet PDF文件第7页 
December 2007  
TM  
UniFET  
FDP12N50F / FDPF12N50FT  
tm  
N-Channel MOSFET  
500V, 11.5A, 0.7Ω  
Features  
Description  
RDS(on) = 0.59( Typ.)@ VGS = 10V, ID = 6A  
Low gate charge ( Typ. 21nC)  
Low Crss ( Typ. 11pF)  
These N-Channel enhancement mode power field effect transis-  
tors are produced using Fairchild’s proprietary, planar stripe,  
DMOS technology.  
This advance technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high effi-  
cient switching mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improve dv/dt capability  
RoHS compliant  
D
G
TO-220F  
FDPF Series  
TO-220  
FDP Series  
G D S  
G D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
VGSS  
Parameter  
FDP12N50F FDPF12N50FT Units  
Drain to Source Voltage  
Gate to Source Voltage  
500  
±30  
V
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- P uls ed  
11.5  
6.9  
46  
11.5*  
6.9*  
46*  
ID  
D r a in C u r r e n t  
A
IDM  
D rai n Cur rent  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
456  
11.5  
16.5  
4.5  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
(TC = 25oC)  
- Derate above 25oC  
165  
42  
PD  
Power Dissipation  
1.33  
0.33  
W/oC  
oC  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FDP12N50F FDPF12N50FT Units  
RθJC  
RθCS  
RθJA  
0.75  
0.5  
3.0  
-
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP12N50F / FDPF12N50FT Rev. A1  
1
www.fairchildsemi.com  

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