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FDN359BN PDF预览

FDN359BN

更新时间: 2024-11-21 11:15:39
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
7页 276K
描述
N 沟道逻辑电平 PowerTrench® MOSFET 30V,2.7A,46mΩ

FDN359BN 技术参数

是否无铅:不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:10 weeks风险等级:0.93
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:167142Samacsys Pin Count:3
Samacsys Part Category:Integrated CircuitSamacsys Package Category:SOT23 (3-Pin)
Samacsys Footprint Name:SSOT-3LSamacsys Released Date:2015-04-13 16:43:21
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):2.7 A
最大漏源导通电阻:0.046 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):100 pFJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDN359BN 数据手册

 浏览型号FDN359BN的Datasheet PDF文件第2页浏览型号FDN359BN的Datasheet PDF文件第3页浏览型号FDN359BN的Datasheet PDF文件第4页浏览型号FDN359BN的Datasheet PDF文件第5页浏览型号FDN359BN的Datasheet PDF文件第6页浏览型号FDN359BN的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
POWERTRENCH), Logic  
Level  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
30 V  
0.046 W @ 10 V  
0.060 W @ 4.5 V  
2.7 A  
FDN359BN  
D
General Description  
This NChannel Logic Level MOSFET is produced using onsemi’s  
advanced POWERTRENCH process that has been especially tailored  
to minimize the onstate resistance and yet maintain superior  
switching performance.  
G
S
SOT23/SUPERSOTt23, 3 LEAD, 1.4x2.9  
CASE 527AG  
These devices are well suited for low voltage and battery powered  
applications where low inline power loss and fast switching are  
required.  
MARKING DIAGRAM  
Features  
359BMG  
2.7 A, 30 V  
G
R  
R  
= 0.046 W @ V = 10 V  
GS  
DS(ON)  
= 0.060 W @ V = 4.5 V  
DS(ON)  
GS  
359B = Specific Device Code  
Very Fast Switching Speed  
Low Gate Charge (5 nC Typical)  
High Performance Version of Industry Standard SOT23 Package.  
Identical Pin Out to SOT23 with 30% Higher Power Handling  
Capability  
M
G
= Month Code  
= PbFree Package  
(Note: Microdot may be in either location)  
PIN ASSIGNMENT  
This Device is PbFree and Halide Free  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, unless otherwise noted)  
D
A
Symbol  
Parameter  
DrainSource Voltage  
Value  
Unit  
V
V
DSS  
V
GSS  
30  
20  
GateSource Voltage  
V
I
D
Maximum Drain  
Current  
Continuous (Note 1a)  
Pulsed  
2.7  
A
G
S
15  
P
D
Maximum Power  
Dissipation  
(Note 1a)  
0.5  
W
(Note 1b)  
0.46  
T , T  
Operating and Storage Temperature Range  
55 to +150  
°C  
J
STG  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
THERMAL CHARACTERISTICS (T = 25°C, unless otherwise noted)  
A
Symbol  
Parameter  
Max  
Unit  
R
Thermal Resistance, JunctiontoAmbient  
(Note 1a)  
250  
°C/W  
q
JA  
R
Thermal Resistance, JunctiontoCase  
(Note 1)  
75  
°C/W  
q
JC  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2023 Rev. 2  
FDN359BN/D  

FDN359BN 替代型号

型号 品牌 替代类型 描述 数据表
2N7002E NXP

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