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FDN360P PDF预览

FDN360P

更新时间: 2024-01-11 04:34:36
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
6页 281K
描述
PowerTrench MOSFET,单 P 沟道

FDN360P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT
包装说明:SUPERSOT-3针数:3
Reach Compliance Code:unknown风险等级:5.36
其他特性:LOGIC LEVEL COMPATIBLE配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):2 A
最大漏源导通电阻:0.08 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL认证状态:COMMERCIAL
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDN360P 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Single, P-Channel,  
POWERTRENCH)  
SOT23  
CASE 527AG  
FDN360P  
General Description  
D
This PChannel Logic Level MOSFET is produced using onsemi’s  
advanced POWERTRENCH process that has been especially tailored  
to minimize the onstate resistance and yet maintain low gate charge  
for superior switching performance.  
These devices are well suited for low voltage and battery powered  
applications where low inline power loss and fast switching are  
required.  
G
S
Features  
MARKING DIAGRAM  
2 A, 30 V  
R  
R  
= 80 mW @ V = 10 V  
GS  
DS(ON)  
360MG  
= 125 mW @ V = 4.5 V  
DS(ON)  
GS  
G
Low Gate Charge (6.2 nC Typical)  
High Performance Trench Technology for Extremely Low R  
High Power Version of Industry Standard SOT23 Package. Identical  
PinOut to SOT23 with 30% Higher Power Handling Capability  
These Devices are PbFree and are RoHS Compliant  
DS(ON)  
360  
= Specific Device Code  
= Date Code  
M
G
= PbFree Package  
(Note: Microdot may be in either location)  
ABSOLUTE MAXIMUM RATINGS  
A
ORDERING INFORMATION  
(T = 25°C unless otherwise noted)  
Symbol  
Parameter  
DrainSource Voltage  
Ratings  
30  
Unit  
V
Device  
Package  
Shipping  
V
DSS  
GSS  
FDN360P  
SOT23  
(Pb-Free,  
Halide Free)  
3000 /  
Tape & Reel  
GateSource Voltage  
20  
V
V
Drain Current  
Continuous (Note 1a)  
Pulsed  
A
I
D
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
2  
10  
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
W
P
D
0.5  
0.46  
Operating and Storage Junction  
Temperature Range  
_C  
55 to +150  
T , T  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Ratings  
Unit  
Thermal Resistance,  
JunctiontoAmbient (Note 1a)  
°C/W  
250  
R
θ
JA  
Thermal Resistance, JunctiontoCase  
(Note 1)  
°C/W  
75  
R
θ
JC  
© Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
January, 2023 Rev. 8  
FDN360P/D  

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