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FDN360P (KDN360P) PDF预览

FDN360P (KDN360P)

更新时间: 2024-11-13 18:09:19
品牌 Logo 应用领域
科信 - KEXIN /
页数 文件大小 规格书
4页 125K
描述
P-Channel MOSFET

FDN360P (KDN360P) 数据手册

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SMD Type  
MOSFET  
P-Channel MOSFET  
FDN360P (KDN360P)  
SOT-23  
Unit : mm  
+0.1  
2.9 -0.1  
+0.1  
0.4 -0.1  
Ƶ Features  
ƽ VDS (V) = -30 V  
3
ƽ
ƽ
ƽ
I
D
= -2 A  
R
DS(ON) = 0.080 ȍ @ VGS = -10 V  
DS(ON) = 0.125 ȍ @ VGS = -4.5 V  
R
1
2
+0.1  
+0.05  
0.95 -0.1  
1.9 -0.1  
0.1 -0.01  
+0.1  
D
1. Gate  
2. Source  
3. Drain  
S
G
Ƶ Absolute Maximum Ratings  
TA  
= 25ć unless otherwise noted  
Parameter  
Symbol  
Rating  
-30  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain Current  
Pulsed Drain Current  
VDS  
GS  
V
20  
I
D
-2  
A
W
I
DM  
-20  
(Note 1a)  
(Note 1b)  
0.5  
Power Dissipation  
P
D
0.46  
250  
Thermal Resistance.Junction- to-Ambient  
Thermal Resistance.Junction- to-Case  
Junction Temperature  
(Note 1a)  
(Note 1)  
R
thJA  
thJC  
ć/W  
ć
R
75  
T
J
150  
Storage Temperature Range  
Notes:  
Tstg  
-55 to 150  
1. RșJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is  
defined as the solder mounting surface of the drain pins. RșJC is guaranteed by design while RșCA is determined by  
the user's board design.  
a. 250ć/W when mounted on a 0.02 in2 pad of 2oz Cu.  
c. 270ć/W when mounted on a 0.001in2 pad of 2oz Cu.  
1
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