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FDN360 PDF预览

FDN360

更新时间: 2024-01-29 18:00:00
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 233K
描述
Single P-Channel PowerTrenchTM MOSFET

FDN360 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOT包装说明:SUPERSOT-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.34
其他特性:LOGIC LEVEL COMPATIBLE配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):2 A
最大漏极电流 (ID):2 A最大漏源导通电阻:0.08 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):0.5 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDN360 数据手册

 浏览型号FDN360的Datasheet PDF文件第2页浏览型号FDN360的Datasheet PDF文件第3页浏览型号FDN360的Datasheet PDF文件第4页浏览型号FDN360的Datasheet PDF文件第5页浏览型号FDN360的Datasheet PDF文件第6页浏览型号FDN360的Datasheet PDF文件第7页 
February 1999  
FDN360P  
Single P-Channel PowerTrenchTM MOSFET  
General Description  
Features  
This P-Channel Logic Level MOSFET is produced using  
Fairchild Semiconductor's advanced PowerTrench process  
that has been especially tailored to minimize on-state  
resistance and yet maintain superior switching  
performance.  
-2 A, -30 V. RDS(on) = 0.080 @ VGS = -10 V  
RDS(on) = 0.125 @ VGS = -4.5 V.  
Low gate charge (5nC typical).  
These devices are well suited for low voltage and battery  
powered applications where low in-line power loss and  
fast switching are required.  
Fast switching speed.  
High performance trench technology for extremely  
low RDS(ON)  
.
Applications  
High power and current handling capability.  
DC/DC converter  
Load switch  
Motor drives  
D
D
S
S
G
SuperSOTTM-3  
G
TA = 25°C unless otherwise noted  
Absolute Maximum Ratings  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
VGSS  
ID  
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current - Continuous  
- Pulsed  
-30  
V
V
A
20  
±
(Note 1a)  
(Note 1a)  
-2  
-20  
PD  
Power Dissipation for Single Operation  
0.5  
W
(Note 1b)  
0.46  
TJ, Tstg  
Operating and Storage Junction Temperature Range  
-55 to +150  
C
°
Thermal Characteristics  
θ
(Note 1a)  
(Note 1)  
R
R
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Case  
250  
75  
C/W  
C/W  
JA  
°
°
JC  
θ
Package Outlines and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape Width  
Quantity  
360  
FDN360P  
7’’  
8mm  
3000 units  
1999 Fairchild Semiconductor Corporation  
FDN360P Rev. D  

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