CSD17311Q5
www.ti.com
SLPS257 –MARCH 2010
30V N-Channel NexFET™ Power MOSFET
Check for Samples: CSD17311Q5
PRODUCT SUMMARY
Drain to Source Voltage
1
FEATURES
VDS
Qg
30
24
V
2
•
•
•
•
•
•
•
•
Optimized for 5V Gate Drive
Ultra Low Qg and Qgd
Low Thermal Resistance
Avalanche Rated
Gate Charge Total (4.5V)
Gate Charge Gate to Drain
nC
nC
mΩ
mΩ
mΩ
V
Qgd
5.2
VGS = 3V
2.3
1.8
1.6
RDS(on) Drain to Source On Resistance
VGS = 4.5V
VGS = 8V
1.2
Pb Free Terminal Plating
RoHS Compliant
VGS(th)
Threshold Voltage
Halogen Free
SON 5-mm × 6-mm Plastic Package
ORDERING INFORMATION
Device
CSD17311Q5
Package
Media
Qty
Ship
APPLICATIONS
SON 5-mm × 6-mm
Plastic Package
13-Inch
Reel
Tape and
Reel
2500
•
Notebook Point-of-Load
•
Point-of-Load Synchronous Buck in
Networking, Telecom and Computing Systems
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise stated
VALUE
UNIT
V
DESCRIPTION
VDS
VGS
Drain to Source Voltage
30
The NexFET™ power MOSFET has been designed
to minimize losses in power conversion applications,
and optimized for 5V gate drive applications.
Gate to Source Voltage
+10 / –8
100
V
Continuous Drain Current, TC = 25°C
Continuous Drain Current(1)
Pulsed Drain Current, TA = 25°C(2)
Power Dissipation(1)
A
ID
32
A
Top View
IDM
PD
TJ,
200
A
3.2
W
S
S
S
G
1
2
3
4
8
7
6
5
D
D
D
Operating Junction and Storage
–55 to 150
638
°C
TSTG Temperature Range
Avalanche Energy, Single Pulse
ID = 113A, L = 0.1mH, RG = 25Ω
EAS
mJ
(1) Typical RqJA
= 40°C/W when mounted on a
1-inch2
(6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 0.06-inch
(1.52-mm) thick FR4 PCB.
D
D
(2) Pulse duration ≤300ms, duty cycle ≤2% TextAddedForSpacing
P0094-01
Text_added_for_spacing_Text_added_for_spacing
RDS(on) vs VGS
GATE CHARGE
6
5
4
3
2
1
0
8
ID = 30A
ID = 30A
VDS = 15V
7
6
5
4
3
2
1
0
TC = 125°C
TC = 25°C
0
1
2
3
4
5
6
7
8
9
10
0
5
10
15
20
25
30
35
40
VGS - Gate-to-Source Voltage - V
Qg - Gate Charge - nC
G006
G003
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NexFET is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated