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CSD17327Q5A PDF预览

CSD17327Q5A

更新时间: 2024-11-13 12:43:31
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德州仪器 - TI 晶体晶体管功率场效应晶体管开关脉冲光电二极管PC局域网
页数 文件大小 规格书
12页 618K
描述
30V, N-Channel NexFET™ Power MOSFETs

CSD17327Q5A 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:6 X 5 MM, ROHS COMPLIANT, PLASTIC, SON-8
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:8 weeks风险等级:1.68
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:749244Samacsys Pin Count:9
Samacsys Part Category:MOSFET (N-Channel)Samacsys Package Category:Other
Samacsys Footprint Name:Q5A VSON-FETSamacsys Released Date:2019-02-12 22:39:45
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):45 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):65 A最大漏极电流 (ID):13 A
最大漏源导通电阻:0.0155 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):33 pFJESD-30 代码:R-PDSO-N8
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):3 W最大脉冲漏极电流 (IDM):85 A
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

CSD17327Q5A 数据手册

 浏览型号CSD17327Q5A的Datasheet PDF文件第2页浏览型号CSD17327Q5A的Datasheet PDF文件第3页浏览型号CSD17327Q5A的Datasheet PDF文件第4页浏览型号CSD17327Q5A的Datasheet PDF文件第5页浏览型号CSD17327Q5A的Datasheet PDF文件第6页浏览型号CSD17327Q5A的Datasheet PDF文件第7页 
CSD17327Q5A  
www.ti.com  
SLPS332 JUNE 2011  
30V, N-Channel NexFETPower MOSFETs  
Check for Samples: CSD17327Q5A  
PRODUCT SUMMARY  
Drain to Source Voltage  
1
FEATURES  
VDS  
Qg  
30  
2.8  
0.8  
V
2
Ultralow Qg and Qgd  
Low Thermal Resistance  
Avalanche Rated  
Pb Free Terminal Plating  
RoHS Compliant  
Gate Charge Total (4.5V)  
Gate Charge Gate to Drain  
nC  
nC  
mΩ  
mΩ  
V
Qgd  
VGS = 4.5V  
VGS = 8V  
12.5  
9.9  
RDS(on) Drain to Source On Resistance  
VGS(th) Threshold Voltage  
1.6  
Halogen Free  
SON 5-mm × 6-mm Plastic Package  
Text Added For Spacing  
ORDERING INFORMATION  
Device  
CSD17327Q5A  
Package  
Media  
Qty  
Ship  
APPLICATIONS  
SON 5-mm × 6-mm  
Plastic Package  
13-Inch  
Reel  
Tape and  
Reel  
Point-of-Load Synchronous Buck in  
2500  
Networking, Telecom and Computing Systems  
Optimized for Control FET Applications  
Text Added For Spacing  
ABSOLUTE MAXIMUM RATINGS  
DESCRIPTION  
TA = 25°C unless otherwise stated  
VALUE  
UNIT  
V
The NexFETpower MOSFET has been designed  
to minimize losses in power conversion applications.  
VDS  
VGS  
Drain to Source Voltage  
30  
Gate to Source Voltage  
+10 / -10  
V
Continuous Drain Current, TC = 25°C  
Continuous Drain Current(1)  
Pulsed Drain Current, TA = 25°C(2)  
Power Dissipation(1)  
65  
13  
85  
3
A
Top View  
ID  
A
S
S
S
G
1
2
3
4
8
7
6
5
D
D
D
IDM  
PD  
TJ,  
A
W
Operating Junction and Storage  
TSTG Temperature Range  
55 to 150  
°C  
Avalanche Energy, single pulse  
ID = 30A, L = 0.1mH, RG = 25Ω  
EAS  
45  
mJ  
D
=
44°C/W on 1-inch2 (6.45-cm2), 2-oz.  
D
(1) Typical RθJA  
(0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4  
PCB.  
P0093-01  
(2) Pulse duration 300μs, duty cycle 2%  
Text 4 Spacing  
RDS(on) vs VGS  
Text 4 Spacing  
GATE CHARGE  
35  
30  
25  
20  
15  
10  
5
10  
ID = 11A  
ID = 11A  
VDD = 15V  
9
8
7
6
5
4
3
2
1
0
TC = 25°C  
TC = 125ºC  
0
0
1
2
3
4
5
6
7
8
9
10  
0
1
2
3
4
5
6
Qg - Gate Charge - (nC)  
VGS - Gate-to- Source Voltage - V  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NexFET is a trademark of Texas Instruments.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011, Texas Instruments Incorporated  
 
 

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