CSD17507Q5A
www.ti.com
SLPS243A –JULY 2010–REVISED AUGUST 2010
30V, N-Channel NexFET™ Power MOSFETs
Check for Samples: CSD17507Q5A
PRODUCT SUMMARY
1
FEATURES
VDS
Qg
Drain to Source Voltage
Gate Charge Total (4.5V)
Gate Charge Gate to Drain
30
2.8
0.7
V
2
•
•
•
•
•
•
•
Ultralow Qg and Qgd
Low Thermal Resistance
Avalanche Rated
nC
nC
mΩ
mΩ
V
Qgd
VGS = 4.5V
VGS = 10V
1.6
11.8
9
RDS(on) Drain to Source On Resistance
VGS(th) Threshold Voltage
Pb Free Terminal Plating
RoHS Compliant
Halogen Free
Text Added For Spacing
ORDERING INFORMATION
SON 5-mm × 6-mm Plastic Package
Device
CSD17507Q5A
Package
Media
Qty
Ship
APPLICATIONS
SON 5-mm × 6-mm
Plastic Package
13-Inch
Reel
Tape and
Reel
2500
•
Point-of-Load Synchronous Buck in
Networking, Telecom and Computing Systems
•
Optimized for Control FET Applications
Text Added For Spacing
ABSOLUTE MAXIMUM RATINGS
DESCRIPTION
TA = 25°C unless otherwise stated
VALUE
UNIT
V
VDS
VGS
Drain to Source Voltage
30
20 / –12
65
The NexFET™ power MOSFET has been designed
to minimize losses in power conversion applications.
Gate to Source Voltage
V
Continuous Drain Current, TC = 25°C
Continuous Drain Current(1)
Pulsed Drain Current, TA = 25°C(2)
Power Dissipation(1)
A
ID
Top View
13
A
IDM
PD
TJ,
85
A
S
S
S
G
1
2
3
4
8
7
6
5
D
D
D
3
W
Operating Junction and Storage
–55 to 150
145
°C
TSTG Temperature Range
Avalanche Energy, single pulse
ID = 30A, L = 0.1mH, RG = 25Ω
EAS
mJ
44°C/W on 1-inch2 (6.45-cm2), 2-oz.
D
(1) Typical RqJA
=
D
(0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4
PCB.
P0093-01
(2) Pulse duration ≤300ms, duty cycle ≤2%
Text 4 Spacing
RDS(on) vs VGS
Text 4 Spacing
GATE CHARGE
30
25
20
15
10
5
20
ID = 11A
ID = 11A
18
VDS = 15V
16
14
12
10
8
TC = 125°C
6
4
TC = 25°C
2
0
0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
VGS - Gate-to-Source Voltage - V
Qg - Gate Charge - nC
G006
G003
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NexFET is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated