CSD17559Q5
www.ti.com
SLPS374 –NOVEMBER 2012
30V N-Channel NexFET™ Power MOSFETs
Check for Samples: CSD17559Q5
PRODUCT SUMMARY
1
FEATURES
TA = 25°C unless otherwise stated
TYPICAL VALUE
UNIT
V
2
•
•
•
•
•
•
•
•
Extremely Low Resistance
Ultralow Qg and Qgd
VDS
Qg
Drain to Source Voltage
Gate Charge Total (4.5V)
Gate Charge Gate to Drain
30
39
nC
nC
mΩ
mΩ
V
Low Thermal Resistance
Avalanche Rated
Qgd
9.3
VGS = 4.5V
VGS = 10V
1.15
0.95
RDS(on) Drain to Source On Resistance
VGS(th) Threshold Voltage
Pb Free Terminal Plating
RoHS Compliant
1.4
Halogen Free
ORDERING INFORMATION
SON 5-mm × 6-mm Plastic Package
Device
CSD17559Q5
Package
Media
Qty
Ship
SON 5-mm × 6-mm
Plastic Package
13-Inch
Reel
Tape and
Reel
2500
APPLICATIONS
•
Point-of-Load Synchronous Buck in
Networking, Telecom, and Computing Systems
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise stated
VALUE
UNIT
V
•
•
Synchronous Rectification
VDS
VGS
Drain to Source Voltage
Gate to Source Voltage
30
Active ORing and Hotswap Applications
±20
V
Continuous Drain Current (Package limited),
TC = 25°C
100
257
DESCRIPTION
The NexFET™ power MOSFET has been designed
to minimize losses in synchronous rectification and
other power conversion applications.
A
ID
Continuous Drain Current (Silicon limited),
TC = 25°C
Continuous Drain Current(1)
Pulsed Drain Current, TA = 25°C(1)(2)
Power Dissipation(1)
40
250
3.2
A
A
IDM
PD
TJ,
Top View
W
Operating Junction and Storage
TSTG Temperature Range
–55 to 150
541
°C
S
S
S
G
1
2
3
4
8
7
6
5
D
D
D
Avalanche Energy, single pulse
ID = 104A, L = 0.1mH, RG = 25Ω
EAS
mJ
(1) Typical RθJA = 40°C/W on 1-inch2 (6.45-cm2), 2-oz. (0.071-
mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB.
(2) Pulse duration ≤300μs, duty cycle ≤2%
D
D
P0093-01
SPACE
RDS(on) vs VGS
SPACE
GATE CHARGE
6
5
4
3
2
1
0
10
TC = 25°C Id = 40A
TC = 125ºC Id = 40A
ID = 40A
VDS =15V
8
6
4
2
0
0
2
4
6
8
10
12
0
10
20
30
40
50
60
70
80
90
Qg - Gate Charge (nC)
VGS - Gate-to- Source Voltage (V)
G001
G001
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NexFET is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated