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CSD17382F4 PDF预览

CSD17382F4

更新时间: 2024-11-14 11:13:59
品牌 Logo 应用领域
德州仪器 - TI 开关脉冲晶体管栅极
页数 文件大小 规格书
13页 1172K
描述
采用 1mm x 0.6mm LGA 封装、具有栅极 ESD 保护的单路、67mΩ、30V、N 沟道 NexFET™ 功率 MOSFET

CSD17382F4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:CHIP CARRIER, R-XBCC-N3
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:6 weeks风险等级:1.69
雪崩能效等级(Eas):2.1 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE AND RESISTOR最小漏源击穿电压:30 V
最大漏极电流 (ID):2.3 A最大漏源导通电阻:0.18 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):19.5 pF
JESD-30 代码:R-XBCC-N3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):14.8 A
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

CSD17382F4 数据手册

 浏览型号CSD17382F4的Datasheet PDF文件第2页浏览型号CSD17382F4的Datasheet PDF文件第3页浏览型号CSD17382F4的Datasheet PDF文件第4页浏览型号CSD17382F4的Datasheet PDF文件第5页浏览型号CSD17382F4的Datasheet PDF文件第6页浏览型号CSD17382F4的Datasheet PDF文件第7页 
CSD17382F4  
SLPS562C – APRIL 2016 – REVISED FEBRUARY 2022  
CSD17382F4 30-V N-Channel FemtoFETMOSFET  
Product Summary  
1 Features  
TA = 25°C  
TYPICAL VALUE  
UNIT  
V
Low on-resistance  
Low Qg and Qgd  
Low threshold voltage  
Ultra-small footprint (0402 case size)  
– 1.0 mm × 0.6 mm  
Ultra-low profile  
VDS  
Qg  
Drain-to-Source Voltage  
30  
2.1  
Gate Charge Total (4.5 V)  
Gate Charge Gate-to-Drain  
nC  
nC  
mΩ  
mΩ  
mΩ  
mΩ  
V
Qgd  
0.63  
VGS = 1.8 V  
110  
67  
VGS = 2.5 V  
VGS = 4.5 V  
VGS = 8.0 V  
RDS(on) Drain-to-Source On-Resistance  
56  
– 0.36-mm height  
54  
Integrated ESD protection diode  
– Rated > 3-kV HBM  
– Rated > 2-kV CDM  
Lead and halogen free  
RoHS compliant  
VGS(th) Threshold Voltage  
0.9  
.
Device Information  
DEVICE(1)  
CSD17382F4  
CSD17382F4T  
QTY  
3000  
250  
MEDIA  
PACKAGE  
SHIP  
7-Inch  
Reel  
Femto (0402) 1.0-mm ×  
0.6-mm SMD Lead Less  
Tape and  
Reel  
2 Applications  
Optimized for load switch applications  
Optimized for general purpose switching  
applications  
Single-cell battery applications  
Handheld and mobile applications  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
Absolute Maximum Ratings  
TA = 25°C  
VALUE  
UNIT  
V
VDS  
VGS  
ID  
Drain-to-Source Voltage  
30  
3 Description  
Gate-to-Source Voltage  
Continuous Drain Current(1)  
Pulsed Drain Current(2)  
Power Dissipation(1)  
10  
V
This 30-V, 54-mΩ, N-Channel FemtoFETMOSFET  
technology is designed and optimized to minimize the  
footprint in many handheld and mobile applications.  
This technology is capable of replacing standard  
small signal MOSFETs while providing at least a 60%  
reduction in footprint size.  
2.3  
A
IDM  
PD  
14.8  
500  
A
mW  
V
Human Body Model (HBM)  
Charged Device Model (CDM)  
3000  
2000  
ESD  
Rating  
V
TJ,  
Tstg  
Operating Junction,  
Storage Temperature  
–55 to 150  
2.1  
°C  
.
Avalanche Energy, Single Pulse ID = 6.5 A,  
L = 0.1 mH, RG = 25 Ω  
EAS  
mJ  
(1) Typical RθJA = 245°C/W on 1-in2 (6.45-cm2), 2-oz.  
0.36 mm  
(0.071-mm) thick Cu pad on a 0.06-in (1.52-mm) thick FR4  
PCB.  
(2) Pulse duration ≤100 μs, duty cycle ≤1%.  
1.00 mm  
0.60 mm  
D
Typical Part Dimensions  
.
.
.
.
G
S
Top View  
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
 
 
 

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