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BSZ0901NSIATMA1 PDF预览

BSZ0901NSIATMA1

更新时间: 2024-11-24 21:16:35
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲光电二极管晶体管
页数 文件大小 规格书
9页 600K
描述
Power Field-Effect Transistor, 25A I(D), 30V, 0.0028ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TSDSON-8

BSZ0901NSIATMA1 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-N3
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:26 weeks
风险等级:1.63雪崩能效等级(Eas):80 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):25 A
最大漏源导通电阻:0.0028 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-N3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):160 A
表面贴装:YES端子面层:Tin (Sn)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

BSZ0901NSIATMA1 数据手册

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BSZ0901NSI  
OptiMOSTM Power-MOSFET  
Product Summary  
Features  
VDS  
30  
2.1  
40  
28  
41  
V
• Optimized SyncFET for high performance buck converter  
• Integrated monolithic Schottky-like diode  
• Very low on-resistance R DS(on) @ V GS=4.5 V  
• 100% avalanche tested  
RDS(on),max  
ID  
mW  
A
QOSS  
nC  
nC  
QG(0V..10V)  
• Superior thermal resistance  
PG-TSDSON-8 (fused leads)  
• N-channel  
• Qualified according to JEDEC1) for target applications  
• Pb-free lead plating; RoHS compliant  
• Halogen-free according to IEC61249-2-21  
Type  
Marking  
Package  
BSZ0901NSI  
PG-TSDSON-8 (fused leads)  
0901NSI  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
V GS=10 V, T C=25 °C  
Continuous drain current  
40  
40  
40  
A
V GS=10 V, T C=100 °C  
V GS=4.5 V, T C=25 °C  
V GS=4.5 V,  
T C=100 °C  
40  
25  
V GS=10 V, T A=25 °C,  
R thJA=60 K/W2)  
Pulsed drain current3)  
I D,pulse  
I AS  
T C=25 °C  
160  
20  
Avalanche current, single pulse4)  
Avalanche energy, single pulse  
Gate source voltage  
T C=25 °C  
E AS  
V GS  
I D=20 A, R GS=25 W  
80  
mJ  
V
±20  
1) J-STD20 and JESD22  
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev. 2.2  
page 1  
2013-05-13  

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