Material Content Data Sheet
Sales Product Name BSZ0902NSI
Issued
14. August 2015
36.48 mg
MA#
MA001013832
Package
PG-TSDSON-8-26
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
phosphorus
zinc
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
0.393
0.002
0.010
0.197
7.988
0.030
0.037
1.924
16.721
0.400
0.020
0.016
0.012
0.592
0.001
0.005
0.094
3.816
0.001
0.005
0.101
4.112
1.08
0.01
0.03
0.54
21.90
0.08
0.10
5.28
45.84
1.10
0.06
0.04
0.03
1.62
0.00
0.01
0.26
10.46
0.00
0.01
0.28
11.27
1.08
10761
67
10761
leadframe
270
iron
5393
218990
810
copper
gold
22.48
0.08
224720
810
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
1024
52751
458371
10971
557
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
51.22
1.10
0.06
512146
10971
557
leadfinish
plating
silver
solder
noble metal
silver
425
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
tin
340
lead
1.69
10.73
11.56
16239
32
17004
heatspreader
heat sink CLIP
*deviation
phosphorus
zinc
129
iron
2576
104608
35
copper
phosphorus
zinc
107345
139
iron
2776
112736
copper
115686
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com